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Article
Low-temperature and low-pressure sinter-bonding for thermoelectric generator devices using Cu nanoparticle paste
  • 2026-02
  • Materials Today Communications, v.51
  • Elsevier BV
  • View : 29
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Article
Low-temperature Cu-to-Cu electrode bonding by sintering Cu core-Ag shell nanoparticle paste
  • 2023-03
  • Chung, Seok-Hwan. (2023-03). Low-temperature Cu-to-Cu electrode bonding by sintering Cu core-Ag shell nanoparticle paste. Materials Today Communications, 34. doi: 10.1016/j.mtcomm.2023.105463
  • Elsevier BV
  • View : 327
  • Download : 0
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