DGIST Library Repository

Browsing by Titles

All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

Showing results 1 to 1 of 1

Article
Low-temperature Cu-to-Cu electrode bonding by sintering Cu core-Ag shell nanoparticle paste
  • 2023-03
  • Chung, Seok-Hwan. (2023-03). Low-temperature Cu-to-Cu electrode bonding by sintering Cu core-Ag shell nanoparticle paste. Materials Today Communications, 34. doi: 10.1016/j.mtcomm.2023.105463
  • Elsevier BV
  • View : 268
  • Download : 0
1