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- Park, Byung Nam ;
- ;
- Choi, Sie Young
- 2008-02
- Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
- Elsevier BV
- View : 1067
- Download : 0
- Park, Byung Nam ;
- ;
- Choi, Sie Young
- 2008-02
- Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
- Elsevier BV
- View : 1147
- Download : 0
- Eom, Tae-Kwang ;
- Sari, Windu ;
- Choi, Kyu-Jeong ;
- Shin, Woong-Chul ;
- Kim, Jae Hyun ;
- Lee, Do-Joong ;
- Kim, Ki-Bum ;
- Sohn, Hyunchul ;
- Kim, Soo-Hyun
- 2009
- Eom, Tae-Kwang. (2009). Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2. Electrochemical and Solid State Letters, 12(11), D85–D88. doi: 10.1149/1.3207867
- Electrochemical Society
- View : 330
- Download : 0
- Eom, Tae-Kwang ;
- Sari, Windu ;
- Choi, Kyu-Jeong ;
- Shin, Woong-Chul ;
- Kim, Jae Hyun ;
- Lee, Do-Joong ;
- Kim, Ki-Bum ;
- Sohn, Hyunchul ;
- Kim, Soo-Hyun
- 2009
- Eom, Tae-Kwang. (2009). Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2. Electrochemical and Solid State Letters, 12(11), D85–D88. doi: 10.1149/1.3207867
- Electrochemical Society
- View : 896
- Download : 0
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