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Showing results 1 to 4 of 4

Article
Effects of a magnetic field on the copper metallization using the electroplating process
  • Park, Byung Nam ; 
  • Shon, Yeong Soo ; 
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1144
  • Download : 0
Article
Effects of a magnetic field on the copper metallization using the electroplating process
  • Park, Byung Nam ; 
  • Shon, Yeong Soo ; 
  • Choi, Sie Young
  • 2008-02
  • Park, Byung Nam. (2008-02). Effects of a magnetic field on the copper metallization using the electroplating process. Microelectronic Engineering, 85(2), 308–314. doi: 10.1016/j.mee.2007.06.018
  • Elsevier BV
  • View : 1211
  • Download : 0
Article
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2
  • Eom, Tae-Kwang ; 
  • Sari, Windu ; 
  • Choi, Kyu-Jeong ; 
  • Shin, Woong-Chul ; 
  • Kim, Jae Hyun ; 
  • Lee, Do-Joong ; 
  • Kim, Ki-Bum ; 
  • Sohn, Hyunchul ; 
  • Kim, Soo-Hyun
  • 2009
  • Eom, Tae-Kwang. (2009). Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2. Electrochemical and Solid State Letters, 12(11), D85–D88. doi: 10.1149/1.3207867
  • Electrochemical Society
  • View : 394
  • Download : 0
Article
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2
  • Eom, Tae-Kwang ; 
  • Sari, Windu ; 
  • Choi, Kyu-Jeong ; 
  • Shin, Woong-Chul ; 
  • Kim, Jae Hyun ; 
  • Lee, Do-Joong ; 
  • Kim, Ki-Bum ; 
  • Sohn, Hyunchul ; 
  • Kim, Soo-Hyun
  • 2009
  • Eom, Tae-Kwang. (2009). Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2. Electrochemical and Solid State Letters, 12(11), D85–D88. doi: 10.1149/1.3207867
  • Electrochemical Society
  • View : 974
  • Download : 0
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