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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Article
Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
  • Kim, Kiwan ; 
  • Kong, Daeyoung ; 
  • Kim, Yunseo ; 
  • Jang, Bongho ; 
  • Cho, Jungwan ; 
  • Kwon, Hyuk-Jun ; 
  • Lee, Hyoungsoon
  • 2024-03
  • Kim, Kiwan. (2024-03). Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap. Applied Thermal Engineering, 241. doi: 10.1016/j.applthermaleng.2023.122325
  • Elsevier
  • View : 479
  • Download : 0
Article
Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels
  • Kong, Daeyoung ; 
  • Kwon, Heungdong ; 
  • Jang, Bongho ; 
  • Kwon, Hyuk-Jun ; 
  • Asheghi, Mehdi ; 
  • Goodson, Kenneth E. ; 
  • Lee, Hyoungsoon
  • 2024-09
  • Kong, Daeyoung. (2024-09). Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels. Energy Conversion and Management, 315. doi: 10.1016/j.enconman.2024.118809
  • Elsevier
  • View : 363
  • Download : 0
Article
Simulation of an innovative polymer electrolyte membrane fuel cell design for self-control thermal management
  • Bates, Alex ; 
  • Hwang, Sunwook ; 
  • Mukherjee, Santanu ; 
  • Lee, Sang C. ; 
  • Kwon, Osung ; 
  • Choi, Gyeung Ho ; 
  • Park, Sam
  • 2013-07
  • Bates, Alex. (2013-07). Simulation of an innovative polymer electrolyte membrane fuel cell design for self-control thermal management. International Journal of Hydrogen Energy, 38(20), 8422–8436. doi: 10.1016/j.ijhydene.2013.04.114
  • Elsevier Ltd
  • View : 1027
  • Download : 0
Article
Thermal-Aware Scheduling for Integrated CPUs-GPU Platforms
  • 2019-10
  • Lee, Youngmoon. (2019-10). Thermal-Aware Scheduling for Integrated CPUs-GPU Platforms. Transactions on Embedded Computing Systems, 18(5s). doi: 10.1145/3358235
  • Association for Computing Machinary, Inc.
  • View : 768
  • Download : 0
Article
Thermally induced structural evolution of diamond surface for pool boiling enhancement
  • Kim, Yunseo ; 
  • Kong, Daeyoung ; 
  • Park, Jeonghwan ; 
  • Jang, Bongho ; 
  • Kim, Taeyeon ; 
  • Kwon, Hyuk-Jun ; 
  • Cho, Jungwan ; 
  • Bin In, Jung ; 
  • Lee, Hyoungsoon
  • 2026-03
  • APPLIED THERMAL ENGINEERING, v.289
  • PERGAMON-ELSEVIER SCIENCE LTD
  • View : 102
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