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Issue Date	Title Author(s) Journal	View
2024-03	Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap Kim, Kiwan ; Kong, Daeyoung ; Kim, Yunseo ; Jang, Bongho ; Cho, Jungwan ; Kwon, Hyuk-Jun ; Lee, Hyoungsoon Applied Thermal Engineering, v.241, 2024-03	111
2013-07	Simulation of an innovative polymer electrolyte membrane fuel cell design for self-control thermal management Bates, Alex ; Hwang, Sunwook ; Mukherjee, Santanu ; Lee, Sang C. ; Kwon, Osung ; Choi, Gyeung Ho ; Park, Sam International Journal of Hydrogen Energy, v.38, no.20, pp.8422 - 8436, 2013-07	673
2019-10	Thermal-Aware Scheduling for Integrated CPUs-GPU Platforms Lee, Youngmoon ; Shin, Kang G. ; Chwa, Hoon Sung Transactions on Embedded Computing Systems, v.18, no.5s, 2019-10	524

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