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Article
Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
- Kim, Kiwan ;
- Kong, Daeyoung ;
- Kim, Yunseo ;
- ;
- Cho, Jungwan ;
- Kwon, Hyuk-Jun ;
- Lee, Hyoungsoon
- 2024-03
- Kim, Kiwan. (2024-03). Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap. Applied Thermal Engineering, 241. doi: 10.1016/j.applthermaleng.2023.122325
- Elsevier
- View : 364
- Download : 0
- Kong, Daeyoung ;
- Kwon, Heungdong ;
- ;
- Kwon, Hyuk-Jun ;
- Asheghi, Mehdi ;
- Goodson, Kenneth E. ;
- Lee, Hyoungsoon
- 2024-09
- Kong, Daeyoung. (2024-09). Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels. Energy Conversion and Management, 315. doi: 10.1016/j.enconman.2024.118809
- Elsevier
- View : 192
- Download : 0
- Bates, Alex ;
- ;
- Mukherjee, Santanu ;
- Lee, Sang C. ;
- ;
- Choi, Gyeung Ho ;
- Park, Sam
- 2013-07
- Bates, Alex. (2013-07). Simulation of an innovative polymer electrolyte membrane fuel cell design for self-control thermal management. International Journal of Hydrogen Energy, 38(20), 8422–8436. doi: 10.1016/j.ijhydene.2013.04.114
- Elsevier Ltd
- View : 904
- Download : 0
- Lee, Youngmoon ;
- Shin, Kang G. ;
- Chwa, Hoon Sung
- 2019-10
- Lee, Youngmoon. (2019-10). Thermal-Aware Scheduling for Integrated CPUs-GPU Platforms. Transactions on Embedded Computing Systems, 18(5s). doi: 10.1145/3358235
- Association for Computing Machinary, Inc.
- View : 681
- Download : 0
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