Division of Nanotechnology 3. Patents
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유연 열전 모듈 및 그 제조 방법

Title
유연 열전 모듈 및 그 제조 방법
Alternative Title
FLEXIBLE THERMOELECTRIC MODULE AND MANUFACTURING METHODS THEREOF
Author(s)
윤태영 ; 김종태 ; 김동환 ; 백주영
Country
KO
Application Date
2019-09-23
Application No.
10-2019-0116626
Registration Date
2020-06-10
Publication No.
10-2123319
Assignee
(재)대구경북과학기술원(100/100)
URI
http://hdl.handle.net/20.500.11750/12264 10-2019-0116626
Abstract
유연 열전 모듈이 개시된다. 상기 유연 연절 모듈은, 허니콤(honeycomb) 구조로 배치된 복수의 원형 홀을 포함하는 유연성 폴리머 층; N형 반도체 및 P형 반도체를 각각 포함하며, 상기 N형 반도체 및 상기 P형 반도체가 교번적으로 나타나도록 상기 복수의 원형 홀에 삽입된 복수의 열전 소자; 및 상기 복수의 열전 소자를 상호간 전기적으로 연결하는 복수의 전극;을 포함할 수 있다.
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