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Thermally expanding base of heatsink to receive fins
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dc.contributor.author 김민수 -
dc.contributor.author 박힘찬 -
dc.date.accessioned 2021-09-30T17:30:50Z -
dc.date.available 2021-09-30T17:30:50Z -
dc.identifier.uri http://hdl.handle.net/20.500.11750/15363 -
dc.description.abstract Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins thermally dissipate heat from the base and into a surrounding environment. The fins are secured within the grooves with an interference fit produced by thermally expanding the base. -
dc.title Thermally expanding base of heatsink to receive fins -
dc.title.alternative GRAPH UPSCALING METHOD FOR PRESERVING GRAPH PROPERTIES -
dc.type Patent -
dc.identifier.bibliographicCitation 김민수. Thermally expanding base of heatsink to receive fins. -
dc.publisher.country US -
dc.identifier.patentApplicationNumber 11107187 -
dc.date.application 2005-04-15 -
dc.identifier.patentRegistrationNumber 07286352 -
dc.date.registration 2007-10-23 -
dc.contributor.assignee Robert B. Curtis,Roy Mehdi Zeighami,Christian L. Belady,Brent A. Boudreaux -
dc.type.iprs 특허 -
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