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High-temperature Bi2Te3 thermoelectric generator fabricated using Cu nanoparticle paste bonding

Title
High-temperature Bi2Te3 thermoelectric generator fabricated using Cu nanoparticle paste bonding
Author(s)
Chung, Seok-HwanKim, Jong TaeKim, HoyoungKim, JeongminKim, Dong Hwan
Issued Date
2022-03
Citation
Journal of Alloys and Compounds, v.896
Type
Article
Author Keywords
Bi2Te3Copper nanoparticleLead-free solderSpark plasma sinteringThermoelectric power generator
Keywords
POWER-GENERATIONRELIABILITYPERFORMANCECHALLENGESSTRENGTHFIGUREMERITJOINTLEGS
ISSN
0925-8388
Abstract
For the successful commercialization of Bi2Te3-based thermoelectric generator (TEG) devices, not only highly efficient TE materials, but also reliable bonding materials with high thermal stability are essential. In this study, we investigated the application of Cu nanoparticle paste (CNP) bonding for increasing the operating temperature of Bi2Te3-based TEG devices. Six-chip TEG devices were fabricated by joining surface-metalized Bi2Te3-based TE chips and Cu electrodes by CNP bonding. The optimal bonding was achieved when spark plasma sintering was carried out at 310–320 °C and 15 MPa. The 6-chip Bi2Te3-based TEG devices showed a maximum output power of 50–60 mW at the hot-side temperature of 400 °C (∆T= 380 °C) and maintained almost the same output power after five thermal cycles. The scanning electron microscopy images of the thermally cycled electrodes further confirmed the robustness of the Cu nanoparticle joints. This work provides an effective method for joining TE chips and Cu electrodes for high-temperature TEG devices. © 2021
URI
http://hdl.handle.net/20.500.11750/16053
DOI
10.1016/j.jallcom.2021.163060
Publisher
Elsevier BV
Related Researcher
  • 정석환 Chung, Seok-Hwan
  • Research Interests Nanotechnology; 나노기술; Materials Science; 재료과학; Magnetism; 자성체; Graphene; 그래핀; Display Technology; 디스플레이 기술
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Division of Nanotechnology 1. Journal Articles

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