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Deep Learning-Based Phenotypic Assessment of Red Cell Storage Lesions for Safe Transfusions
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Title
Deep Learning-Based Phenotypic Assessment of Red Cell Storage Lesions for Safe Transfusions
Issued Date
2022-03
Citation
Kim, Eunji. (2022-03). Deep Learning-Based Phenotypic Assessment of Red Cell Storage Lesions for Safe Transfusions. IEEE Journal of Biomedical and Health Informatics, 26(3), 1318–1328. doi: 10.1109/JBHI.2021.3104650
Type
Article
Author Keywords
Deep learninggenerative adversarial networkdigital holographic imagingphenotypic analysis of red cellsred cell storage lesionsRBC classificationsemantic RBC segmentationsafe transfusions
Keywords
DIGITAL HOLOGRAPHIC MICROSCOPYBLOOD-CELLSNUMERICAL RECONSTRUCTIONSEGMENTATIONEXTRACTIONCONTRASTBIOLOGY
ISSN
2168-2194
Abstract
This study presents a novel approach to automatically perform instant phenotypic assessment of red blood cell (RBC) storage lesion in phase images obtained by digital holographic microscopy. The proposed model combines a generative adversarial network (GAN) with marker-controlled watershed segmentation scheme. The GAN model performed RBC segmentations and classifications to develop ageing markers, and the watershed segmentation was used to completely separate overlapping RBCs. Our approach achieved good segmentation and classification accuracy with a Dice's coefficient of 0.94 at a high throughput rate of about 152 cells per second. These results were compared with other deep neural network architectures. Moreover, our image-based deep learning models recognized the morphological changes that occur in RBCs during storage. Our deep learning-based classification results were in good agreement with previous findings on the changes in RBC markers (dominant shapes) affected by storage duration. We believe that our image-based deep learning models can be useful for automated assessment of RBC quality, storage lesions for safe transfusions, and diagnosis of RBC-related diseases.
URI
http://hdl.handle.net/20.500.11750/16506
DOI
10.1109/JBHI.2021.3104650
Publisher
Institute of Electrical and Electronics Engineers Inc.
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