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Effect of Metal-Precursor Stacking Order on Volume-Defect Formation in CZTSSe Thin Film: Formation Mechanism of Blisters and Nanopores
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- Title
- Effect of Metal-Precursor Stacking Order on Volume-Defect Formation in CZTSSe Thin Film: Formation Mechanism of Blisters and Nanopores
- Issued Date
- 2022-06
- Citation
- Kim, Se-Yun. (2022-06). Effect of Metal-Precursor Stacking Order on Volume-Defect Formation in CZTSSe Thin Film: Formation Mechanism of Blisters and Nanopores. ACS Applied Materials & Interfaces, 14(27), 30649–30657. doi: 10.1021/acsami.2c01892
- Type
- Article
- Author Keywords
- blister ; metal precursor ; CZTSSe ; stacking order ; nanopore
- Keywords
- PHOTOVOLTAIC PROPERTIES ; CU2ZNSNS4 ; PERFORMANCE ; EVOLUTION ; SELENIZATION ; FABRICATION ; QUALITY ; CUINSE2 ; GRAIN-GROWTH ; SOLAR-CELLS
- ISSN
- 1944-8244
- Abstract
-
In this study, we investigated the effect of the stacking order of metal precursors on the formation of volume defects, such as blisters and nanopores, in CZTSSe thin-film solar cells. We fabricated CZTSSe thin films using three types of metal-precursor combinations, namely, Zn/Cu/Sn/Mo, Cu/Zn/Sn/Mo, and Sn/Cu/Zn/Mo, and studied the blister formation. The blister-formation mechanism was based on the delamination model, taking into consideration the compressive stress and adhesion properties. A compressive stress could be induced during the preferential formation of a ZnSSe shell. Under this stress, the adhesion between the ZnSSe film and the Mo substrate could be maintained by the surface tension of a metallic liquid phase with good wettability, or by the functioning of ZnSSe pillars as anchors, depending on the type of metal precursor used. Additionally, the nanopore formation near the back-contact side was found to be induced by the columnar microstructure of the metal precursor with the Cu/Zn/Mo stacking order and its dezincification. Based on the two volume-defect-formation mechanisms proposed herein, further development of volume-defect-formation suppression technology is expected to be made. © 2022 American Chemical Society.
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- Publisher
- American Chemical Society
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