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dc.contributor.author Moon, Hyunmin -
dc.contributor.author Park, Byungwook -
dc.contributor.author Kim, Sohee -
dc.date.accessioned 2023-12-26T18:44:04Z -
dc.date.available 2023-12-26T18:44:04Z -
dc.date.created 2021-06-08 -
dc.date.issued 2021-06-21 -
dc.identifier.isbn 9781665412674 -
dc.identifier.uri http://hdl.handle.net/20.500.11750/46922 -
dc.description.abstract 3-dimensional (3D) structures composed of flexible and soft materials have been in demand for bio-integrated devices. However, the fabrication of 3D structures using micro electro mechanical systems (MEMS) techniques has limitations in terms of commonly used inorganic materials and the microscale of resulted structures. Here, we developed a novel technique to selectively bond polydimethylsiloxane (PDMS) and parylene C by plasma treatment, with which 2D structures fabricated using conventional MEMS techniques are transformed into 3D structures by the inflation of selectively non-bonded patterns. We demonstrated various soft and flexible 3D devices with embedded electrical functions for biomedical applications. © 2021 IEEE. -
dc.language English -
dc.publisher Transducer Research Foundation -
dc.title TRANSFORMATION OF 2D PLANES INTO 3D SOFT STRUCTURES WITH ELECTRICAL FUNCTIONS -
dc.type Conference Paper -
dc.identifier.doi 10.1109/Transducers50396.2021.9495560 -
dc.identifier.scopusid 2-s2.0-85114963246 -
dc.identifier.bibliographicCitation 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021, pp.1 - 3 -
dc.citation.conferencePlace US -
dc.citation.endPage 3 -
dc.citation.startPage 1 -
dc.citation.title 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 -
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