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2. Conference Papers 1

- Year

Issue Date Title First-Author(s) Citation Views
2017
Low temperature atomic layer deposition of Ru thin films using a new carbonyl-based Ru precursor and non-oxidizing reactants; Applications to the seed layer for Cu metallization

Lee, Hyun-Jung; Nabeya, Shunichi; Hong, Tae Eun; Harada, Ryosuke; Kim, Soo-Hyun

2017 IEEE International Interconnect Technology Conference, IITC 2017

144
1

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