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THERMALLY CONDUCTIVE SHEET ENABLING ALIGNMENT USING LOW MAGNETIC FIELD, AND MANUFACTURING METHOD THEREFOR
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dc.contributor.author 김동환 -
dc.contributor.author 김종태 -
dc.contributor.author 정석환 -
dc.date.accessioned 2025-07-28T16:40:13Z -
dc.date.available 2025-07-28T16:40:13Z -
dc.identifier.uri https://scholar.dgist.ac.kr/handle/20.500.11750/58746 -
dc.description.abstract The present invention relates to a thermally conductive sheet having high thermal conductivity and a manufacturing method therefor, the thermally conductive sheet being formed by dispersing a thermally conductive filler in a polymer resin of the thermally conductive sheet and then applying a low magnetic field thereto, thereby aligning the thermally conductive filler in the vertical direction or the horizontal direction of the sheet. The thermally conductive sheet of the present invention enables the alignment direction of the thermally conductive filler to be changed by adjusting the direction of the magnetic field, and thus the structure of the thermally conductive sheet can be adjusted. -
dc.title THERMALLY CONDUCTIVE SHEET ENABLING ALIGNMENT USING LOW MAGNETIC FIELD, AND MANUFACTURING METHOD THEREFOR -
dc.title.alternative Thermal conductive sheet capable of filler alignment using a low magnetic field and its manufacturing method -
dc.type Patent -
dc.publisher.country UN -
dc.identifier.patentApplicationNumber PCT/KR2024/013132 -
dc.date.application 2024-09-02 -
dc.identifier.patentRegistrationNumber 2025058303 -
dc.date.registration 2025-03-20 -
dc.contributor.assignee DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY,재단법인대구경북과학기술원 -
dc.type.iprs 특허 -
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