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열전소자의 저압 소결 접합 방법 및 이를 통해 제조된 열전소자
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김정민 | - |
| dc.contributor.author | 김동환 | - |
| dc.contributor.author | 정석환 | - |
| dc.contributor.author | 김종태 | - |
| dc.date.accessioned | 2026-11-01T02:10:30Z | - |
| dc.date.available | 2026-11-01T02:10:30Z | - |
| dc.identifier.uri | https://scholar.dgist.ac.kr/handle/20.500.11750/61041 | - |
| dc.title | 열전소자의 저압 소결 접합 방법 및 이를 통해 제조된 열전소자 | - |
| dc.title.alternative | LOW PRESSURE SINTERING BONDING METHOD FOR THERMOELECTRIC DEVICE AND THERMOELECTRIC DEVICE MANUFACTURED THEREBY | - |
| dc.type | Patent | - |
| dc.publisher.country | KO | - |
| dc.identifier.patentApplicationNumber | 10-2025-0064093 | - |
| dc.date.application | 2025-05-16 | - |
| dc.identifier.patentRegistrationNumber | 10-3030021 | - |
| dc.date.registration | 2026-10-02 | - |
| dc.contributor.assignee | (재)대구경북과학기술원(100/100) | - |
| dc.type.iprs | 특허 | - |
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