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CMOS High-Voltage Analog 1-64 Multiplexer/Demultiplexer for Integrated Ultrasound Guided Breast Needle Biopsy
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Title
CMOS High-Voltage Analog 1-64 Multiplexer/Demultiplexer for Integrated Ultrasound Guided Breast Needle Biopsy
DGIST Authors
Jung, HayongWodnicki, RobertLim, Hae GyunYoon, Chi WooKang, BongjinYoon, ChanghanLee, ChangyangHwang, Jae YounKim, Hyung HamChoi, HojongChen, Mike Shuo-WeiZhou, QifaShung, K. Kirk
Issued Date
2018-08
Citation
Jung, Hayong. (2018-08). CMOS High-Voltage Analog 1-64 Multiplexer/Demultiplexer for Integrated Ultrasound Guided Breast Needle Biopsy. doi: 10.1109/TUFFC.2018.2837127
Type
Article
Article Type
Article
Author Keywords
Biopsy needlebreast cancerhigh frequencyhigh-voltage switchsynthetic aperture imagingultrasound
Keywords
PIEZO-COMPOSITEHIGH-SPEEDASPIRATIONARRAY
ISSN
0885-3010
Abstract
Ultrasound guided needle biopsy is an important method for collection of breast cancer tissue. In this paper, we report on the design and testing of a high-voltage 1 to 64 Multiplexer/Demultiplexer (MUX/De-MUX) integrated circuit (IC) for ultrasound-guided breast biopsy applications implemented in a high-voltage CMOS process. The IC is intended to be incorporated inside the breast biopsy needle and is designed to fit inside the needle inner diameter of 2.38 mm. The MUX/De-MUX electronics are made up of three parts, including a low-voltage 6 to 64 decoder, a level shifter to convert from low voltage to high voltage, and analog high-voltage switches. Experimental results show a-3-dB bandwidth of over 70 MHz, Rds (on) of 140 Ω,-2.279-dB insertion loss, and-17.5-dB off isolation at 70 MHz with low-voltage input. Finally, we present results obtained via synthetic aperture imaging using the fabricated MUX/De-Mux device and a high-frequency ultrasound array. This device and technique hold promise for high-frequency imaging probes where a limited number of elements are used and the depth of penetration is short such as in breast biopsy and intravascular applications. © 2018 IEEE.
URI
http://hdl.handle.net/20.500.11750/6557
DOI
10.1109/TUFFC.2018.2837127
Publisher
Institute of Electrical and Electronics Engineers Inc.
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