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Method for evaluating interfacial resistances of thermoelectric devices using I-V measurement
- Method for evaluating interfacial resistances of thermoelectric devices using I-V measurement
- Kim, Dong Hwan; Kim, Cham; Kim, Jong Tae; Yoon, Duck Ki; Kim, Hoyoung
- DGIST Authors
- Kim, Dong Hwan; Kim, Cham; Kim, Hoyoung
- Issue Date
- Measurement: Journal of the International Measurement Confederation, 129, 281-287
- Article Type
- Contact resistance; Current voltage characteristics; Electric contacts; Energy conversion; Heat transfer; Open circuit voltage; Power generation; Short circuit currents; Thermal insulating materials; Thermoelectric energy conversion; Conversion characteristics; Electrical contact resistance; Interfacial resistances; Interfacial thermal resistance; One-dimensional heat; Predicting and analyzing; Thermal interface materials; Thermoelectric devices; Heat resistance
- Research on the methodology for predicting and analyzing the performance of a thermoelectric device (TED) can offer various possibilities for enhancing its energy conversion characteristics. In this work, the methodology to determine the electrical contact resistance and the interfacial thermal resistance of a TED was studied. Based on one-dimensional heat transfer equations of power generation mode that includes electrical contact resistance and interfacial thermal resistance, we derived explicit expressions for the open circuit voltage and the short circuit current as the limiting cases of the external electrical load. The measurements of the open circuit voltage and the short-circuit current of TED were carried out for various thermal interface materials (TIMs) between the TED and heat reservoirs under varying compressive forces. The electrical contact resistance and the interfacial thermal resistance of a TED were determined by matching the measured values of the open circuit voltage and the short circuit current of a TED to the results of the analytic model. The electrical contact resistivity of the TED tested was approximately 3 × 10−9 Ωm2, irrespective of the compressive force, the hot-side temperature, and the TIMs. The interfacial thermal resistance varied sensitively with the TIMs and decreased with the compressive forces. © 2018 Elsevier Ltd
- Elsevier B.V.
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