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Thermal stability and Young's modulus of mechanically exfoliated flexible mica

Title
Thermal stability and Young's modulus of mechanically exfoliated flexible mica
Authors
Jin, Da WoonKo, Young JoonKong, Dae SolKim, Hyun KiHa, Jae-HyunLee, MinbaekHong, Jung-IlJung, Jong Hoon
DGIST Authors
Hong, Jung-Il
Issue Date
2018-12
Citation
Current Applied Physics, 18(12), 1486-1491
Type
Article
Article Type
Article
Author Keywords
Flexible micaThermal stabilityYoung&aposs modulus
Keywords
THIN-FILMS
ISSN
1567-1739
Abstract
In recent years, mica has been successfully used as a substrate for the growth of flexible epitaxial ferroelectric oxide thin films. Here, we systematically investigated the flexibility of mica in terms of its thickness, repeated bending/unbending, extremely hot/cold conditions, and successive thermal cycling. A 20-μm-thick sheet of mica is flexible even up to the bending radius of 5 mm, and it is durable for 20,000 cycles of up- and down-bending. In addition, the mica shows flexibility at 10 and 773 K, and thermal cycling stability for the temperature variation of ca. 400 K. Compared with the widely used flexible polyimide, mica has a significantly higher Young's modulus (ca. 5.4 GPa) and negligible hysteresis in the force-displacement curve. These results show that mica should be a suitable substrate for piezoelectric energy-harvesting applications of ferroelectric oxide thin films at extremely low and high temperatures. © 2018 Korean Physical Society
URI
http://hdl.handle.net/20.500.11750/9327
DOI
10.1016/j.cap.2018.09.002
Publisher
Elsevier B.V.
Related Researcher
  • Author Hong, Jung-Il Spin Nanotech Laboratory
  • Research Interests Electric and Magnetic Properties of Nanostructured Materials; Spintronics
Files:
There are no files associated with this item.
Collection:
Department of Emerging Materials ScienceSpin Nanotech Laboratory1. Journal Articles


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