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Thermal stability and Young's modulus of mechanically exfoliated flexible mica
- Thermal stability and Young's modulus of mechanically exfoliated flexible mica
- Jin, Da Woon; Ko, Young Joon; Kong, Dae Sol; Kim, Hyun Ki; Ha, Jae-Hyun; Lee, Minbaek; Hong, Jung-Il; Jung, Jong Hoon
- DGIST Authors
- Hong, Jung-Il
- Issue Date
- Current Applied Physics, 18(12), 1486-1491
- Article Type
- Author Keywords
- Flexible mica; Thermal stability; Young' s modulus
- In recent years, mica has been successfully used as a substrate for the growth of flexible epitaxial ferroelectric oxide thin films. Here, we systematically investigated the flexibility of mica in terms of its thickness, repeated bending/unbending, extremely hot/cold conditions, and successive thermal cycling. A 20-μm-thick sheet of mica is flexible even up to the bending radius of 5 mm, and it is durable for 20,000 cycles of up- and down-bending. In addition, the mica shows flexibility at 10 and 773 K, and thermal cycling stability for the temperature variation of ca. 400 K. Compared with the widely used flexible polyimide, mica has a significantly higher Young's modulus (ca. 5.4 GPa) and negligible hysteresis in the force-displacement curve. These results show that mica should be a suitable substrate for piezoelectric energy-harvesting applications of ferroelectric oxide thin films at extremely low and high temperatures. © 2018 Korean Physical Society
- Elsevier B.V.
- Related Researcher
Spin Nanotech Laboratory
Electric and Magnetic Properties of Nanostructured Materials; Spintronics
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- Department of Emerging Materials ScienceSpin Nanotech Laboratory1. Journal Articles
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