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Issue Date	Title Author(s) Journal	View
2024-03	Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap Kim, Kiwan ; Kong, Daeyoung ; Kim, Yunseo ; Jang, Bongho ; Cho, Jungwan ; Kwon, Hyuk-Jun ; Lee, Hyoungsoon Applied Thermal Engineering, v.241, 2024-03	114

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