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- Kim, Jang Hwan ;
- ;
- Kim, Bong Hoon
- 2023-06
- Kim, Jang Hwan. (2023-06). Applications of flexible and stretchable three-dimensional structures for soft electronics. Soft Science, 3(2). doi: 10.20517/ss.2023.07
- OAE Publishing
- View : 838
- Download : 1043
- Kim, Bong Hoon ;
- Liu, Fei ;
- Yu, Yongjoon ;
- Jang, Hokyung ;
- Xie, Zhaoqian ;
- Li, Kan ;
- Lee, Jungyup ;
- Jeong, Ji Yoon ;
- Ryu, Arin ;
- Lee, Yechan ; et al
- 2018-11
- Kim, Bong Hoon. (2018-11). Mechanically Guided Post-Assembly of 3D Electronic Systems. Advanced Functional Materials, 28(48), 1–10. doi: 10.1002/adfm.201803149
- Wiley-VCH Verlag
- View : 913
- Download : 0
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