Showing results 1 to 2 of 2
- 2023-06
- Kim, Jang Hwan. (2023-06). Applications of flexible and stretchable three-dimensional structures for soft electronics. Soft Science, 3(2). doi: 10.20517/ss.2023.07
- OAE Publishing
- View : 535
- Download : 764
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Kim, Bong Hoon
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Liu, Fei
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Yu, Yongjoon
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Jang, Hokyung
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Xie, Zhaoqian
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Li, Kan
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Lee, Jungyup
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Jeong, Ji Yoon
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Ryu, Arin
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Lee, Yechan
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et al
- 2018-11
- Kim, Bong Hoon. (2018-11). Mechanically Guided Post-Assembly of 3D Electronic Systems. Advanced Functional Materials, 28(48), 1–10. doi: 10.1002/adfm.201803149
- Wiley-VCH Verlag
- View : 874
- Download : 0
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