Cited 13 time in webofscience Cited 11 time in scopus

Mechanically Guided Post-Assembly of 3D Electronic Systems

Title
Mechanically Guided Post-Assembly of 3D Electronic Systems
Authors
Kim, Bong HoonLiu, FeiYu, YongjoonJang, HokyungXie, ZhaoqianLi, KanLee, JungyupJeong, Ji YoonRyu, ArinLee, YechanKim, Do HoonWang, XuejuLee, Kun HyuckLee, Jong YoonWon, Sang MinOh, NuriKim, JeonghyunKim, Ju YoungJeong, Seong-JunJang, Kyung-InLee, SeungminHuang, YonggangZhang, YihuiRogers, John A.
DGIST Authors
Jang, Kyung-In
Issue Date
2018-11
Citation
Advanced Functional Materials, 28(48), 1-10
Type
Article
Article Type
Article
Keywords
3D electronic devicesmechanical bucklingnear-field communicationAntennasFlexible electronicsNear field communicationPrinted circuit boardsElectromagnetic propertiesElectronic deviceFlexible printed circuit boardsGeometry transformationskirigamiMultifunctional systemsOpto-electronic sensorsorigamiSubstrates
ISSN
1616-301X
Abstract
This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off-the-shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out-of-plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near-field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state-of-the-art components. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
URI
http://hdl.handle.net/20.500.11750/9324
DOI
10.1002/adfm.201803149
Publisher
Wiley-VCH Verlag
Related Researcher
  • Author Jang, Kyung-In Bio-integrated Electronics Lab
  • Research Interests Extreme mechanics; Stand-alone electronics; Heterogeneous materials; Biocompatible interfaces
Files:
There are no files associated with this item.
Collection:
Department of Robotics EngineeringBio-integrated Electronics Lab1. Journal Articles


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