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Issue Date Title Author(s) Journal View
2024-03
Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap

Kim, Kiwan ;  Kong, Daeyoung ;  Kim, Yunseo ;  Jang, Bongho ;  Cho, Jungwan ;  Kwon, Hyuk-Jun ;  Lee, Hyoungsoon

Applied Thermal Engineering, v.241, 2024-03

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