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Self-Bondable and Stretchable Conductive Composite Fibers with Spatially Controlled Percolated Ag Nanoparticle Networks: Novel Integration Strategy for Wearable Electronics

Title
Self-Bondable and Stretchable Conductive Composite Fibers with Spatially Controlled Percolated Ag Nanoparticle Networks: Novel Integration Strategy for Wearable Electronics
Authors
Kwon, ChaebeenSeong, DuhwanHa, JeongdaeChun, DongwonBae, Jee-HwanYoon, KukroLee, MinkyuWoo, JanghoonWon, ChihyeongLee, SeungminMei, YongfengJang, Kyung-InSon, DongheeLee, Taeyoon
DGIST Authors
Kwon, Chaebeen; Seong, Duhwan; Ha, Jeongdae; Chun, Dongwon; Bae, Jee-Hwan; Yoon, Kukro; Lee, Minkyu; Woo, Janghoon; Won, Chihyeong; Lee, Seungmin; Mei, Yongfeng; Jang, Kyung-In; Son, Donghee; Lee, Taeyoon
Issue Date
2020-12
Citation
Advanced Functional Materials, 30(49), 2005447
Type
Article
Article Type
Article
Author Keywords
fiber component integrationself-bondable conductive fibersstretchable and flexible interconnectswearable electronics
Keywords
CARBON-NANOTUBE FIBERSSILVER NANOPARTICLESSENSORWIRESPUNYARN
ISSN
1616-301X
Abstract
Advances in electronic textiles (E-textiles) for next-generation wearable electronics have originated from making a balance between electrical and mechanical properties of stretchy conductive fibers. Despite such progress, the trade-off issue is still a challenge when individual fibers are woven and/or stretched undesirably. Time-consuming fiber weaving has limited practical uses in scalable E-textiles. Here, a facile method is presented to fabricate ultra-stretchable Ag nanoparticles (AgNPs)/polyurethane (PU) hybrid conductive fibers by modulating solvent diffusion accompanied by in situ chemical reduction and adopting a tough self-healing polymer (T-SHP) as an encapsulation layer. First, the controlled diffusivity determines how formation of AgNPs is spatially distributed inside the fiber. Specifically, when a solvent with large molecular weight is used, the percolated AgNP networks exhibit the highest conductivity (30 485 S cm−1) even at 300% tensile strain and durable stretching cyclic performance without severe cracks by virtue of the efficient strain energy dissipation of T-SHP encapsulation layers. The self-bondable properties of T-SHP encapsulated fibers enables self-weavable interconnects. Using the new integration, mechanical and electrical durability of the self-bonded fiber interconnects are demonstrated while stretching biaxially. Furthermore, the self-bonding assembly is further visualized via fabrication of a complex structured E-textile. © 2020 Wiley-VCH GmbH
URI
http://hdl.handle.net/20.500.11750/12662
DOI
10.1002/adfm.202005447
Publisher
Wiley-VCH Verlag
Related Researcher
  • Author Jang, Kyung-In Bio-integrated Electronics Lab
  • Research Interests Extreme mechanics; Stand-alone electronics; Heterogeneous materials; Biocompatible interfaces
Files:
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Collection:
Department of Robotics EngineeringBio-integrated Electronics Lab1. Journal Articles


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