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Hierarchical self-assembly of thickness-modulated block copolymer thin films for controlling nanodomain orientations inside bare silicon trenches

Title
Hierarchical self-assembly of thickness-modulated block copolymer thin films for controlling nanodomain orientations inside bare silicon trenches
Authors
Shin, Jin YongOh, Young TaekKim, SimonLim, Hoe YeonLee, BomKo, Young ChunPark, ShinSeon, Seung WonLee, Se GiMun, Seung SooKim, Bong Hoon
DGIST Authors
Shin, Jin Yong; Oh, Young Taek; Kim, Simon; Lim, Hoe Yeon; Lee, Bom; Ko, Young Chun; Park, Shin; Seon, Seung Won; Lee, Se Gi; Mun, Seung Soo; Kim, Bong Hoon
Issue Date
2021-02
Citation
Polymers, 13(4), 1-10
Type
Article
Keywords
block copolymersthickness gradientdirected self-assemblygraphoepitaxydefectnanolithography
ISSN
2073-4360
Abstract
We study the orientation and ordering of nanodomains of a thickness-modulated lamellar block copolymer (BCP) thin film at each thickness region inside a topological nano/micropattern of bare silicon wafers without chemical pretreatments. With precise control of the thickness gradient of a BCP thin film and the width of a bare silicon trench, we successfully demonstrate (i) perfectly oriented lamellar nanodomains, (ii) pseudocylindrical nanopatterns as periodically aligned defects from the lamellar BCP thin film, and (iii) half-cylindrical nanostructure arrays leveraged by a trench sidewall with the strong preferential wetting of the PMMA block of the BCP. Our strategy is simple, efficient, and has an advantage in fabricating diverse nanopatterns simultaneously compared to conventional BCP lithography utilizing chemical pretreatments, such as a polymer brush or a selfassembled monolayer (SAM). The proposed self-assembly nanopatterning process can be used in energy devices and biodevices requiring various nanopatterns on the same device and as next-generation nanofabrication processes with minimized fabrication steps for low-cost manufacturing techniques. © 2021 by the authors.
URI
http://hdl.handle.net/20.500.11750/16458
DOI
10.3390/polym13040553
Publisher
MDPI Open Access Publishing
Related Researcher
  • Author Kim, Bong Hoon Bonghoon Group
  • Research Interests IoT Devices; Medical Devices; 3D Materials; Nanomaterials; Self-assembly
Files:
There are no files associated with this item.
Collection:
Department of Robotics and Mechatronics EngineeringBonghoon Group1. Journal Articles


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