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Department of Electrical Engineering and Computer Science
Advanced Electronic Devices Research Group(AEDRG) - Kwon Lab.
1. Journal Articles
Sub-Zero Temperature Sensor Based on Laser-Written Carbon
Baek, Seungho
;
Kim, Junil
;
Pujar, Pavan
;
Kwon, Hyuk-Jun
;
Kim, Sunkook
;
Gandla, Srinivas
Department of Electrical Engineering and Computer Science
Advanced Electronic Devices Research Group(AEDRG) - Kwon Lab.
1. Journal Articles
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Title
Sub-Zero Temperature Sensor Based on Laser-Written Carbon
Issued Date
2022-07
Citation
Baek, Seungho. (2022-07). Sub-Zero Temperature Sensor Based on Laser-Written Carbon. Advanced Electronic Materials, 8(7). doi: 10.1002/aelm.202101252
Type
Article
Author Keywords
electron hopping mechanism
;
glassy carbon
;
laser-induced carbonization
;
sub-zero temperature sensor
Keywords
FILMS
ISSN
2199-160X
Abstract
Sub-zero temperature sensors (SZTSs) have potential applications in safely storing COVID-19 vaccines. Herein, an SZTS based on laser-induced carbonization (LIC) achieved by a nanosecond infrared laser with a wavelength of 1064nm is reported. Direct laser writing is adopted for laser-induced carbon in Kapton polyimide sheets with a thickness of 125µm. The sensor exhibits a good linear change in resistance to sub-zero temperatures ranging from 0 to −150°C, where the coefficient of determination adjusted R-square (R2) value is 0.99238, which indicates a good linear fit. The sensor exhibits a stable static response at all temperatures over time. The dynamic responses by controlling the liquid nitrogen gas and placing an ice cube on the sensor are also measured to validate the sensor. Notably, the electrical performance of the sensor remains stable even after 15 h. The sensor response of the LIC sample validates the 3D variable range-hopping charge transport mechanism, governed by the Mott equation with a good linear fit, which is mainly owing to disorder in its structure. LIC-based SZTSs can enable sensors that are ultra-fast to fabricate, roll-to-roll processable, economical, and more significantly, can be interfaced with flexible printed circuit boards without any additional interfacing. © 2022 Wiley-VCH GmbH
URI
http://hdl.handle.net/20.500.11750/16482
DOI
10.1002/aelm.202101252
Publisher
Wiley-VCH Verlag
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Kwon, Hyuk-Jun
권혁준
Department of Electrical Engineering and Computer Science
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