DGIST Scholar: Fast location of opens in TSV-based 3-D chip using simple resistor chain

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Fast location of opens in TSV-based 3-D chip using simple resistor chain

Title: Fast location of opens in TSV-based 3-D chip using simple resistor chain

Author(s): Hu, Sanming ; Jin, Cheng ; Li, Hongyu ; Li, Rui ; Chong, Serchoong ; Jong, Mingchinq ; Wai, Eva ; Teo, Keng Hwa ; Je, Min Kyu ; Lo, Patrickguoqiang

Subject: 3-D Integrated Circuit (3-D IC) ; Chains ; Electric Power Systems ; Electrical Methods ; Location ; Open ; Open Circuits ; Organic Substrate ; Parallel Resistor Chain ; Power Supply ; Resistors ; Three Dimensional Integrated Circuits ; Through-Silicon-Via (TSV) ; Through-Silicon-Vias

Abstract: This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one printed circuit board, one organic substrate, and seven 65-nm CMOS dies stacked using microbumps and through-silicon vias. Results show that, the proposed parallel resistor chain can efficiently locate opens in a complicated 3-D IC within several minutes, using the resistance measured by power supply or multimeter only. © 2014 IEEE.