Cited 2 time in webofscience Cited 2 time in scopus

Fast location of opens in TSV-based 3-D chip using simple resistor chain

Title
Fast location of opens in TSV-based 3-D chip using simple resistor chain
Authors
Hu, SanmingJin, ChengLi, HongyuLi, RuiChong, SerchoongJong, MingchinqWai, EvaTeo, Keng HwaJe, Min KyuLo, Patrickguoqiang
DGIST Authors
Je, Min Kyu
Issue Date
2014
Citation
IEEE Transactions on Electron Devices, 61(7), 2584-2587
Type
Article
Article Type
Article
Keywords
3-D Integrated Circuit (3-D IC)ChainsElectric Power SystemsElectrical MethodsLocationOpenOpen CircuitsOrganic SubstrateParallel Resistor ChainPower SupplyResistorsThree Dimensional Integrated CircuitsThrough-Silicon-Via (TSV)Through-Silicon-Vias
ISSN
0018-9383
Abstract
This brief proposes an electrical method using simple resistor chain in parallel to quickly locate open circuits in a 3-D chip. This method is theoretically analyzed using the equivalent circuit, and experimentally validated by a 3-D integrated circuit (3-D IC). The fabricated 3-D IC consists of one printed circuit board, one organic substrate, and seven 65-nm CMOS dies stacked using microbumps and through-silicon vias. Results show that, the proposed parallel resistor chain can efficiently locate opens in a complicated 3-D IC within several minutes, using the resistance measured by power supply or multimeter only. © 2014 IEEE.
URI
http://hdl.handle.net/20.500.11750/3144
DOI
10.1109/TED.2014.2321453
Publisher
Institute of Electrical and Electronics Engineers Inc.
Files:
There are no files associated with this item.
Collection:
Department of Information and Communication EngineeringIMPACT Lab1. Journal Articles


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