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Division of Energy & Environmental Technology
1. Journal Articles
Fabrication of precisely controlled silicon wire and cone arrays by electrochemical etching
Seo, Hong-Seok
;
Li, Xiaopeng
;
Um, Han-Don
;
Yoo, Bongyoung
;
Kim, Jae-Hyun
;
Kim, Kang-Pil
;
Cho, Yong Woo
;
Lee, Jung-Ho
Division of Energy & Environmental Technology
1. Journal Articles
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Title
Fabrication of precisely controlled silicon wire and cone arrays by electrochemical etching
Issued Date
2009-12-15
Citation
Seo, Hong-Seok. (2009-12-15). Fabrication of precisely controlled silicon wire and cone arrays by electrochemical etching. Materials Letters, 63(29), 2567–2569. doi: 10.1016/j.matlet.2009.09.005
Type
Article
Author Keywords
Microstructure
;
Surfaces
;
Wires
;
Cones
;
Electrochemical etching
Keywords
Chemical Etching
;
Combined Treatment
;
Cone Arrays
;
Cones
;
Electrochemical Etching
;
Etching Time
;
Fabrication
;
Field emitter
;
GROWTH
;
High-Density
;
High-Density Integration
;
Integrated Electronics
;
MECHANISM
;
Micro-Scales
;
Microstructure
;
N-TYPE SILICON
;
Nanowires
;
Ordered Array
;
Sharp Tip
;
Silicon Wires
;
Surfaces
;
Thermoelectric Devices
;
Wire
;
Wire Diameter
;
Wires
ISSN
0167-577X
Abstract
There is an exponentially growing need for well-oriented, vertical silicon nano/micro-structure arrays, particularly in high-density integrated electronic devices. Here, we demonstrate that precisely controlled vertical arrays of silicon wires and cones can be fabricated by a combined treatment strategy of electrochemical and chemical etchings. First, a periodically ordered array of silicon wires was readily fabricated at microscale by simple electrochemical etching in which the current density played a critical role in determining the wire diameter and interspacing. The microstructures fabricated by electrochemical etching were more precisely tuned by further chemical etching, thereby transforming into cone arrays with extremely sharp tips where the cone height was controlled by the etching time. This approach could have broad utility in many electronics requiring miniaturization and high-density integration such as field emitters, photovoltaic and thermoelectric devices. © 2009 Elsevier B.V. All rights reserved.
URI
http://hdl.handle.net/20.500.11750/3542
DOI
10.1016/j.matlet.2009.09.005
Publisher
Elsevier Ltd
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