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dc.contributor.author Kim, Duhee -
dc.contributor.author Kim, Boil -
dc.contributor.author Hong, Nari -
dc.contributor.author Choe, Han Kyoung -
dc.contributor.author Kang, Hongki -
dc.date.accessioned 2024-01-04T10:40:18Z -
dc.date.available 2024-01-04T10:40:18Z -
dc.date.created 2023-10-04 -
dc.date.issued 2023-07-10 -
dc.identifier.isbn 9781665457330 -
dc.identifier.issn 2832-8256 -
dc.identifier.uri http://hdl.handle.net/20.500.11750/47566 -
dc.description.abstract A micro-electrode array (MEA) is essential in the bio-medical field to measure various bio-signals in vitro and in vivo environments. The transparent MEA allows imaging of cell surfaces and organs inside the body. Also, when we perform light-based modulation, such as optogenetics, higher efficiency in response to light can be obtained with a transparent MEA. Here, instead of well-known direct electrode material printing, we print a polymer seed layer that can induce the formation of transparent ultrathin (< 10 nm) metal electrodes with the merits of fabrication simplicity, low processing temperature, and design customizability. We optimized Au deposition thickness and metal film morphology to form conductive and transparent electrodes on selectively printed polymer seed layer regions. These electrodes show improved impedance at low frequencies compared to well-known thick Au-based electrodes. Finally, we successfully recorded brain signals in vivo by placing the flexible electrode array on the surface of the mouse brain. © 2023 IEEE. -
dc.language English -
dc.publisher Institute of Electrical and Electronics Engineers Inc. -
dc.title Optimization of Inkjet-Printed Seed Layer Based Flexible, Transparent Metal Electrode for Bio-Signal Sensing -
dc.type Conference Paper -
dc.identifier.doi 10.1109/FLEPS57599.2023.10220402 -
dc.identifier.scopusid 2-s2.0-85171588000 -
dc.identifier.bibliographicCitation 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023 -
dc.identifier.url https://epapers2.org/fleps2023/ESR/paper_details.php?paper_id=3017 -
dc.citation.conferencePlace US -
dc.citation.conferencePlace Boston -
dc.citation.title 5th IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2023 -

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