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A Kirigami-Engineered "Skeletal Framework" Composite for Ultralow Hysteresis and Highly Stable Strain Sensors
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Title
A Kirigami-Engineered "Skeletal Framework" Composite for Ultralow Hysteresis and Highly Stable Strain Sensors
Issued Date
2025-11
Citation
ACS Sustainable Chemistry & Engineering, v.13, no.46, pp.20179 - 20193
Type
Article
Author Keywords
Strain sensorStretchabilityStabilityBacterial celluloseRobotic arm control
Keywords
BACTERIAL CELLULOSECULTURE
Abstract

Wearable strain sensors are pivotal for next-generation human-machine interfaces, yet achieving high fidelity, robustness, and sustainability in a single platform remains a significant challenge. A primary obstacle is the inherent viscoelasticity of soft materials, which leads to signal drift and hysteresis. Here, we report a highly stretchable and ultrastable strain sensor fabricated through a synergistic integration of Kirigami-based structural engineering and nanocomposite material design. By introducing titanium dioxide nanotubes (TNTs) into a bacterial cellulose (BC) matrix, we create a composite with a unique internal "skeletal framework". This framework substantially reduces viscoelastic losses, resulting in an exceptionally low hysteresis of 0.6% and ensuring robust performance with 99.4% signal stability over >10 000 cycles. Concurrently, the Kirigami-patterned structure enhances stretchability to similar to 235% while the framework amplifies sensitivity 5.8-fold. The practical viability of this high-fidelity sensor is demonstrated through the precise and repeatable control of a robotic arm, where ultralow hysteresis proves more critical than raw sensitivity. The sensor's eco-friendly, water-based fabrication aligns high-fidelity sensing with sustainable processing, presenting a clear design paradigm for engineering reliable and eco-conscious wearable electronic devices.

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URI
https://scholar.dgist.ac.kr/handle/20.500.11750/59334
DOI
10.1021/acssuschemeng.5c08716
Publisher
American Chemical Society
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김회준
Kim, Hoe Joon김회준

Department of Robotics and Mechatronics Engineering

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