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Magnetically Self-Assembled, High-Resolution Stretchable Anisotropic Conductive Films for Ultra-Fine Pitch Microdevice Packaging in Soft Electronics

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Title
Magnetically Self-Assembled, High-Resolution Stretchable Anisotropic Conductive Films for Ultra-Fine Pitch Microdevice Packaging in Soft Electronics
Alternative Title
극미세 피치 마이크로디바이스 패키징을 위한 자기장 유도 자가조립 기반 고해상도 신축성 이방성 도전 필름
DGIST Authors
Minhu JeonByeongmoon Lee
Advisor
이병문
Issued Date
2026
Awarded Date
2026-08-01
Type
Thesis
Description
Soft electronics, Advanced packaging, Heterogeneous integration, Anisotropic conductive adhesives, Anisotropic conductive films
Table Of Contents
Chapter 1. Introduction 1
1.1 Recent Advances in Wearable and Implantable Electronics 1
1.2 Previous Studies of Heterogeneous Integration 6
1.2.1 Conventional microdevice integration technologies 6
1.2.2 Recent studies for soft electronic packaging 7
1.3 Motivation and Organization of This Thesis 9
Chapter 2. Magnetically Self-Assembled and Selectively Patterned Monolayer
Anisotropic Conductive Adhesives (ACAs) 11
2.1 Main Concept 11
2.2 Experimental Section 15
2.2.1 Velocity-Controlled Dip-Transfer Coating 15
2.2.2 Integration of Microdevices onto Conformable Substrates 16
2.3 Results and Discussion 18
2.3.1 Effects of Material and Process Variables on ACA Morphology and Device
Integration 18
2.3.2 Stretchable Mini-LED Displays 22
2.4 Conclusion 25
Chapter 3. Magnetically Self-Assembled, Large Area, and High-Resolution Intrinsically
Stretchable Anisotropic Conductive Films (S-ACFs) for Ultra-Fine-Pitch
Device Integration 26
3.1 Main Concept 26
3.2 Experimental Section 28
3.3 Results and Discussion 30
3.3.1 Morphology of Magnetically Self-Assembled Ferromagnetic Particles in Fluidic
Media 30
3.3.2 Electrical Characterization of Magnetically Self-Assembled S-ACF 35
3.4 Conclusion 38
Chapter 4. Summary, Limitations, and Recommendations for Future Research 39
4.1 Summary and Conclusion 39
4.2 Limitations and Recommendations for Future Research 41
References 43
요 약 문 46
URI
https://scholar.dgist.ac.kr/handle/20.500.11750/60817
http://dgist.dcollection.net/common/orgView/200001014515
DOI
10.22677/THESIS.200001014515
Degree
Master
Department
Department of Electrical Engineering and Computer Science
Publisher
DGIST
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