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Showing results 1 to 4 of 4

  • Chung, Ha Uk ; 
  • Kim, Bong Hoon ; 
  • Lee, Jong Yoon ; 
  • Lee, Jungyup ; 
  • Xie, Zhaoqian ; 
  • Ibler, Erin M. ; 
  • Lee, KunHyuck ; 
  • Banks, Anthony ; 
  • Jeong, Ji Yoon ; 
  • Kim, Jongwon ; 
  • et al
  • 2019-03
  • Chung, Ha Uk. (2019-03). Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care. doi: 10.1126/science.aau0780
  • American Association for the Advancement of Science
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  • Kim, Bong Hoon ; 
  • Liu, Fei ; 
  • Yu, Yongjoon ; 
  • Jang, Hokyung ; 
  • Xie, Zhaoqian ; 
  • Li, Kan ; 
  • Lee, Jungyup ; 
  • Jeong, Ji Yoon ; 
  • Ryu, Arin ; 
  • Lee, Yechan ; 
  • et al
  • 2018-11
  • Kim, Bong Hoon. (2018-11). Mechanically Guided Post-Assembly of 3D Electronic Systems. Advanced Functional Materials, 28(48), 1–10. doi: 10.1002/adfm.201803149
  • Wiley-VCH Verlag
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  • Jeong, Ji Yoon ; 
  • Kim, Sangwon ; 
  • Baek, Eunchong ; 
  • You, Chun-Yeol ; 
  • Choi, Hyoung Jin
  • 2023-01
  • Jeong, Ji Yoon. (2023-01). Suspension rheology of polyaniline coated manganese ferrite particles under electric/magnetic fields. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 656(Part A). doi: 10.1016/j.colsurfa.2022.130438
  • Elsevier B.V.
  • View : 398
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  • Kim, Bong Hoon ; 
  • Lee, Jungyup ; 
  • Won, Sang Min ; 
  • Xie, Zhaoqian ; 
  • Chang, Jan-Kai ; 
  • Yu, Yongjoon ; 
  • Cho, Youn Kyoung ; 
  • Jang, Hokyung ; 
  • Jeong, Ji Yoon ; 
  • Lee, Yechan ; 
  • et al
  • 2018-05
  • Kim, Bong Hoon. (2018-05). Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process. ACS Nano, 12(5), 4164–4171. doi: 10.1021/acsnano.8b00180
  • American Chemical Society
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