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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Article
Mechanically Guided Post-Assembly of 3D Electronic Systems
  • Kim, Bong Hoon ; 
  • Liu, Fei ; 
  • Yu, Yongjoon ; 
  • Jang, Hokyung ; 
  • Xie, Zhaoqian ; 
  • Li, Kan ; 
  • Lee, Jungyup ; 
  • Jeong, Ji Yoon ; 
  • Ryu, Arin ; 
  • Lee, Yechan ; 
    • et al
  • 2018-11
  • Kim, Bong Hoon. (2018-11). Mechanically Guided Post-Assembly of 3D Electronic Systems. Advanced Functional Materials, 28(48), 1–10. doi: 10.1002/adfm.201803149
  • Wiley-VCH Verlag
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Article
Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process
  • Kim, Bong Hoon ; 
  • Lee, Jungyup ; 
  • Won, Sang Min ; 
  • Xie, Zhaoqian ; 
  • Chang, Jan-Kai ; 
  • Yu, Yongjoon ; 
  • Cho, Youn Kyoung ; 
  • Jang, Hokyung ; 
  • Jeong, Ji Yoon ; 
  • Lee, Yechan ; 
    • et al
  • 2018-05
  • Kim, Bong Hoon. (2018-05). Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process. ACS Nano, 12(5), 4164–4171. doi: 10.1021/acsnano.8b00180
  • American Chemical Society
  • View : 760
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