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Showing results 1 to 10 of 10
- Eom, Tae-Kwang ;
- Sari, Windu ;
- Cheon, Taehoon ;
- Kim, Soo-Hyun ;
- Kim, Woo Kyoung
- 2012-10
- Eom, Tae-Kwang. (2012-10). A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects. doi: 10.1016/j.tsf.2012.03.068
- Elsevier BV
- View : 906
- Download : 0
- Yeo, Seungmin ;
- Choi, Sang-Hyeok ;
- Park, Ji-Yoon ;
- Kim, Soo-Hyun ;
- Cheon, Taehoon ;
- Lim, Byoung-Yong ;
- Kim, Sunjung
- 2013-11
- Yeo, Seungmin. (2013-11). Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization. doi: 10.1016/j.tsf.2013.03.074
- Elsevier BV
- View : 771
- Download : 0
- Lee, Young-Hoon ;
- Kang, Jin Soo ;
- Park, Jeong-Hyun ;
- Kang, Jiho ;
- Jo, In-Rok ;
- Sung, Yung-Eun ;
- Ahn, Kwang-Soon
- 2020-06
- Lee, Young-Hoon. (2020-06). Color-switchable electrochromic Co(OH)(2)/Ni(OH)(2) nanofilms with ultrafast kinetics for multifunctional smart windows. doi: 10.1016/j.nanoen.2020.104720
- Elsevier BV
- View : 881
- Download : 0
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- Yoon, Seok Soo ;
- Kim, CheolGi
- 2017-10
- IEEE Magnetics Letters, v.8
- Institute of Electrical and Electronics Engineers Inc.
- View : 967
- Download : 0
- Nandanapalli, Koteeswara Reddy ;
- Mudusu, Devika ;
- Reddy, Gunasekhar K.
- 2019-09
- Nandanapalli, Koteeswara Reddy. (2019-09). Low-cost and nontoxic highly rectifying diodes using p-type tin monosulfide (SnS) thin films and Ti/Au binary contacts. doi: 10.1016/j.mssp.2019.05.001
- Pergamon Press
- View : 707
- Download : 0
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- Eom, Gwang Hyeon ;
- Moon, Janghyuk ;
- Kim, Jung Ho ;
- Park, Min-Sik ;
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- Dou, Shi Xue
- 2022-05
- Shin, Hong Rim. (2022-05). Mechanistic and nanoarchitectonics insight into Li–host interactions in carbon hosts for reversible Li metal storage. Nano Energy, 95. doi: 10.1016/j.nanoen.2022.106999
- Elsevier BV
- View : 366
- Download : 0
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- Yoon, Seok Soo ;
- Kim, CheolGi
- 2015-01
- Torati, Sri Ramulu. (2015-01). Protein immobilization onto electrochemically synthesized CoFe nanowires. International Journal of Nanomedicine, 10(1), 645–651. doi: 10.2147/IJN.S76850
- Dove Medical Press Ltd
- View : 1134
- Download : 68
- 2025-09
- Materials Today, v.88, pp.871 - 887
- Elsevier
- View : 229
- Download : 0
- Mun, Ki-Yeung ;
- Hong, Tae Eun ;
- ;
- Jang, Yujin ;
- Lim, Byoung-Yong ;
- Kim, Sunjung ;
- Kim, Soo-Hyun
- 2014-07-01
- Mun, Ki-Yeung. (2014-07-01). The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect. Thin Solid Films, 562, 118–125. doi: 10.1016/j.tsf.2014.03.088
- Elsevier
- View : 746
- Download : 0
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- Hong, Jung-Il ;
- Park, Seoyeon ; et al
- 2022-12
- Materials Today, v.61, pp.30 - 39
- Elsevier BV
- View : 423
- Download : 0
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