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- Kim, Hyun Min ;
- Park, Ji Won ;
- Lim, Dong Kwon ;
- Moon, Dae Won
- 2017-12
- Kim, Jae Young. (2017-12). Atmospheric pressure mass spectrometric imaging of live hippocampal tissue slices with subcellular spatial resolution. Nature Communications, 8(0), 2113. doi: 10.1038/s41467-017-02216-6
- Nature Publishing Group
- View : 867
- Download : 127
- ;
- Lee, Sun Young ;
- Kim, Hyunmin ;
- Park, Ji-Won ;
- Lim, Dong-Kwon ;
- Moon, Dae Won
- 2018-11
- Kim, Jae Young. (2018-11). Biomolecular Imaging of Regeneration of Zebrafish Caudal Fins using High Spatial Resolution Ambient Mass Spectrometry. doi: 10.1021/acs.analchem.8b03066
- American Chemical Society
- View : 805
- Download : 0
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- Song, Cheol ;
- Park, Ji-Won ;
- Shin, Hyeon Ho ;
- Lim, Dong-Kwon ;
- Moon, Dae Won
- 2019-07
- Kim, Jae Young. (2019-07). Graphene-Coated Glass Substrate for Continuous Wave Laser Desorption and Atmospheric Pressure Mass Spectrometric Imaging of a Live Hippocampal Tissue. ACS Applied Materials & Interfaces, 11(30), 27153–27161. doi: 10.1021/acsami.9b02620
- American Chemical Society
- View : 912
- Download : 0
- Kim, Tae-Hyeon ;
- Lee, HyunKi ;
- Ok, Seung-Ho
- 2024-08
- Kim, Tae-Hyeon. (2024-08). Implementation of an FPGA-Based 3D Shape Measurement System Using High-Level Synthesis. Electronics, 13(16), 1–14. doi: 10.3390/electronics13163282
- MDPI
- View : 365
- Download : 80
- Safi, Qamas Gul Khan ;
- Luo, Senlin ;
- Pan, Limin ;
- Liu, Wangtong ;
- Hussain, Rasheed ;
- 2018-06
- Safi, Qamas Gul Khan. (2018-06). SVPS: Cloud-based smart vehicle parking system over ubiquitous VANETs. Computer Networks, 138, 18–30. doi: 10.1016/j.comnet.2018.03.034
- Elsevier B.V.
- View : 661
- Download : 0
- Dai, Penglin ;
- Liu, Kai ;
- Feng, Liang ;
- Zhang, Haijun ;
- Lee, Victor Chung Sing ;
- Son, Sang Hyuk ;
- Wu, Xiao
- 2019-01
- Dai, Penglin. (2019-01). Temporal Information Services in Large-Scale Vehicular Networks Through Evolutionary Multi-Objective Optimization. IEEE Transactions on Intelligent Transportation Systems, 20(1), 218–231. doi: 10.1109/TITS.2018.2803842
- Institute of Electrical and Electronics Engineers
- View : 996
- Download : 0
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