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Showing results 1 to 4 of 4

Issue Date	Title Author(s) Journal	View
2008-02	Effects of a magnetic field on the copper metallization using the electroplating process Park, Byung Nam ; Shon, Yeong Soo ; Choi, Sie Young Microelectronic Engineering, v.85, no.2, pp.308 - 314, 2008-02	669
2008-02	Effects of a magnetic field on the copper metallization using the electroplating process Park, Byung Nam ; Shon, Yeong Soo ; Choi, Sie Young Microelectronic Engineering, v.85, no.2, pp.308 - 314, 2008-02	615
2009	Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2 Eom, Tae-Kwang ; Sari, Windu ; Choi, Kyu-Jeong ; Shin, Woong-Chul ; Kim, Jae Hyun ; Lee, Do-Joong ; Kim, Ki-Bum ; Sohn, Hyunchul ; Kim, Soo-Hyun Electrochemical and Solid State Letters, v.12, no.11, pp.D85 - D88, 2009	604
2009	Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2 Eom, Tae-Kwang ; Sari, Windu ; Choi, Kyu-Jeong ; Shin, Woong-Chul ; Kim, Jae Hyun ; Lee, Do-Joong ; Kim, Ki-Bum ; Sohn, Hyunchul ; Kim, Soo-Hyun Electrochemical and Solid State Letters, v.12, no.11, pp.D85 - D88, 2009	62

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