Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Chung, Seok-Hwan | - |
dc.contributor.author | Kim, Jong Tae | - |
dc.contributor.author | Kim, Hoyoung | - |
dc.contributor.author | Kim, Dong Hwan | - |
dc.contributor.author | Jeong, Sang Won | - |
dc.date.accessioned | 2022-01-05T12:00:43Z | - |
dc.date.available | 2022-01-05T12:00:43Z | - |
dc.date.created | 2021-12-02 | - |
dc.date.issued | 2022-03 | - |
dc.identifier.issn | 2352-4928 | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11750/16047 | - |
dc.description.abstract | A soft and stable substrate is an essential component for realizing flexible electronics and displays. We fabricated flexible substrate films by compositing iron oxide nanoparticle-conjugated graphite platelets (mGPs) with polyimide (PI). We controlled the microstructure of the composite film by aligning the mGPs with a low magnetic field in the vertical direction during the PI curing process. After magnetic alignment, the through-plane thermal conductivity of the mGP-PI composite film was enhanced by a maximum of 132% with 20 wt% mGP content compared to that without magnetic alignment. The thermal conductivity of the composite film was constant up to 300 °C and increased with the filler content, reaching 11.3 W/mK with 60 wt% mGP content. In addition, the coefficient of thermal expansion (CTE) of the composite film along the in-plane direction decreased with increasing filler content, reaching approximately 9 ppm/K with 40 wt% mGP content. This work demonstrates a pathway toward a flexible electronics substrate with high thermal conductivity, high thermal stability, and low CTE. © 2021 Elsevier Ltd | - |
dc.language | English | - |
dc.publisher | Elsevier BV | - |
dc.title | Magnetic alignment of graphite platelets in polyimide matrix toward a flexible electronic substrate with enhanced thermal conductivity | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.mtcomm.2021.103026 | - |
dc.identifier.wosid | 000736589600003 | - |
dc.identifier.scopusid | 2-s2.0-85120959047 | - |
dc.identifier.bibliographicCitation | Materials Today Communications, v.30 | - |
dc.description.isOpenAccess | FALSE | - |
dc.subject.keywordAuthor | Polymer-matrix composite | - |
dc.subject.keywordAuthor | Magnetic alignment | - |
dc.subject.keywordAuthor | Thermal conductivity | - |
dc.subject.keywordAuthor | Coefficient of Thermal Expansion (CTE) | - |
dc.subject.keywordAuthor | Flexible electronics | - |
dc.subject.keywordPlus | HEXAGONAL BORON-NITRIDE | - |
dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
dc.subject.keywordPlus | COMPOSITE FILMS | - |
dc.subject.keywordPlus | PERFORMANCE | - |
dc.subject.keywordPlus | EXPANSION | - |
dc.citation.title | Materials Today Communications | - |
dc.citation.volume | 30 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.type.docType | Article | - |
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