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Department of Robotics and Mechatronics Engineering
Future Electronic Devices Lab
1. Journal Articles
Directed high-χ block copolymer self-assembly by laser writing on silicon substrate
Jin, Hyeong Min
;
Lee, Su Eon
;
Kim, Simon
;
Kim, Ju Young
;
Han, Young-Soo
;
Kim, Bong Hoon
Department of Robotics and Mechatronics Engineering
Future Electronic Devices Lab
1. Journal Articles
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Title
Directed high-χ block copolymer self-assembly by laser writing on silicon substrate
Issued Date
2022-06
Citation
Jin, Hyeong Min. (2022-06). Directed high-χ block copolymer self-assembly by laser writing on silicon substrate. Journal of Applied Polymer Science, 139(23). doi: 10.1002/app.52291
Type
Article
Author Keywords
block copolymer
;
directed self-assembly
;
photothermal effect
;
self-assembly
Keywords
TEMPERATURE
;
ALIGNMENT
;
ORDER
;
THIN-FILMS
;
NANOSTRUCTURES
;
MECHANISMS
;
SEPARATION
;
THICKNESS
ISSN
0021-8995
Abstract
Polymer self-assembly commonly suffers from retarded equilibrium structure formation caused by the large diffusion barrier of long-chain molecules. In particular, the defect annihilation kinetics of high-χ block copolymers (BCPs) are generally sluggish because of a slow inter-block chain diffusion process from strong inter-block segregation. Therefore, long-range order of high-χ BCPs still hard to be obtained by conventional approaches. Here, we introduce near-infrared laser photothermal treatment to effectively promote high-χ BCP self-assembly and demonstrating highly aligned nanoscale patterned structures on silicon substrates. Adequate molecular weight selection of high-χ PS-b-P2VP system enables one-time laser hot-zone annealing, resulting in highly ordered nanodomains along laser writing direction. Facile sub-sequential metal ion loading to P2VP cylinders enables the formation of highly aligned metal nanowires. Moreover, a commonly used silicon substrate without a photoabsorbing layer is employed as a photo-thermal substrate, demonstrating that the laser writing process is compatible with conventional semiconductor processes. © 2022 Wiley Periodicals LLC.
URI
http://hdl.handle.net/20.500.11750/16372
DOI
10.1002/app.52291
Publisher
John Wiley & Sons Inc.
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Kim, Bong Hoon
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