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Issue Date	Title Author(s) Journal	View
2014-07-01	The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect Mun, Ki-Yeung ; Hong, Tae Eun ; Cheon, Taehoon ; Jang, Yujin ; Lim, Byoung-Yong ; Kim, Sunjung ; Kim, Soo-Hyun Thin Solid Films, v.562, pp.118 - 125, 2014-07-01	498
2013-11	Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization Yeo, Seungmin ; Choi, Sang-Hyeok ; Park, Ji-Yoon ; Kim, Soo-Hyun ; Cheon, Taehoon ; Lim, Byoung-Yong ; Kim, Sunjung Elsevier BV, 2013-11	592
2012-10	A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects Eom, Tae-Kwang ; Sari, Windu ; Cheon, Taehoon ; Kim, Soo-Hyun ; Kim, Woo Kyoung Elsevier BV, 2012-10	651

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