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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김소희 | - |
| dc.contributor.author | 허수진 | - |
| dc.contributor.author | 장현우 | - |
| dc.contributor.author | 최기순 | - |
| dc.contributor.author | 장재은 | - |
| dc.date.accessioned | 2025-07-29T16:10:16Z | - |
| dc.date.available | 2025-07-29T16:10:16Z | - |
| dc.identifier.uri | https://scholar.dgist.ac.kr/handle/20.500.11750/58777 | - |
| dc.description.abstract | The invention provides a vacuum tunneling device and a method for manufacturing the same. The method comprises the following steps: forming a tunneling device on a substrate; forming an insulating interlayer on the substrate, wherein the insulating interlayer is provided with an opening for exposing the tunneling device; and performing a tilted deposition process in the vacuum chamber to form a sealing layer on the insulating interlayer such that the sealing layer fills an upper portion of the opening. | - |
| dc.title | Vacuum tunneling device and method of manufacturing same | - |
| dc.title.alternative | VACUUM TUNNELING DEVICE AND METHOD OF MANUFACTURING THE SAME | - |
| dc.type | Patent | - |
| dc.publisher.country | CC | - |
| dc.identifier.patentApplicationNumber | 202210973702.2 | - |
| dc.date.application | 2022-08-15 | - |
| dc.identifier.patentRegistrationNumber | 115954321 | - |
| dc.date.registration | 2023-04-11 | - |
| dc.contributor.assignee | SAMSUNG ELECTRONICS CO., LTD.,DAEGU GYEONGBUK INSTITUTE OF SCIENCE AND TECHNOLOGY | - |
| dc.type.iprs | 특허 | - |
Department of Electrical Engineering and Computer Science