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열전소자의 저압 소결 접합 방법 및 이를 통해 제조된 열전소자

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Title
열전소자의 저압 소결 접합 방법 및 이를 통해 제조된 열전소자
Alternative Title
LOW PRESSURE SINTERING BONDING METHOD FOR THERMOELECTRIC DEVICE AND THERMOELECTRIC DEVICE MANUFACTURED THEREBY
Country
KO
Application Date
2025-05-16
Application No.
10-2025-0064093
Registration Date
2026-10-02
Publication No.
10-3030021
Assignee
(재)대구경북과학기술원(100/100)
URI
https://scholar.dgist.ac.kr/handle/20.500.11750/61041 10-2025-0064093
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김정민
Kim, Jeongmin김정민

Division of Nanotechnology

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