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dc.contributor.author Kim, Bong Hoon -
dc.contributor.author Lee, Jungyup -
dc.contributor.author Won, Sang Min -
dc.contributor.author Xie, Zhaoqian -
dc.contributor.author Chang, Jan-Kai -
dc.contributor.author Yu, Yongjoon -
dc.contributor.author Cho, Youn Kyoung -
dc.contributor.author Jang, Hokyung -
dc.contributor.author Jeong, Ji Yoon -
dc.contributor.author Lee, Yechan -
dc.contributor.author Ryu,Arin -
dc.contributor.author Kim, Do Hoon -
dc.contributor.author Lee, Kun Hyuck -
dc.contributor.author Lee, Jong Yoon -
dc.contributor.author Liu, Fei -
dc.contributor.author Wang, Xueju -
dc.contributor.author Huo, Qingze -
dc.contributor.author Min, Seunghwan -
dc.contributor.author Wu, Di -
dc.contributor.author Ji, Bowen -
dc.contributor.author Banks, Anthony -
dc.contributor.author Kim, Jeonghyun -
dc.contributor.author Oh, Nuri -
dc.contributor.author Jin, Hyeong Min -
dc.contributor.author Han, Seungyong -
dc.contributor.author Kang, Daeshik -
dc.contributor.author Lee, Chi Hwan -
dc.contributor.author Song, Young Min -
dc.contributor.author Zhang, Yihui -
dc.contributor.author Huang, Yonggang -
dc.contributor.author Jang, Kyung-In -
dc.contributor.author Rogers, John A. -
dc.date.accessioned 2018-06-11T00:40:03Z -
dc.date.available 2018-06-11T00:40:03Z -
dc.date.created 2018-06-10 -
dc.date.issued 2018-05 -
dc.identifier.issn 1936-0851 -
dc.identifier.uri http://hdl.handle.net/20.500.11750/6586 -
dc.description.abstract Recently developed approaches in deterministic assembly allow for controlled, geometric transformation of two-dimensional structures into complex, engineered three-dimensional layouts. Attractive features include applicability to wide ranging layout designs and dimensions along with the capacity to integrate planar thin film materials and device layouts. The work reported here establishes further capabilities for directly embedding high-performance electronic devices into the resultant 3D constructs based on silicon nanomembranes (Si NMs) as the active materials in custom devices or microscale components released from commercial wafer sources. Systematic experimental studies and theoretical analysis illustrate the key ideas through varied 3D architectures, from interconnected bridges and coils to extended chiral structures, each of which embed n-channel Si NM MOSFETs (nMOS), Si NM diodes, and p-channel silicon MOSFETs (pMOS). Examples in stretchable/deformable systems highlight additional features of these platforms. These strategies are immediately applicable to other wide-ranging classes of materials and device technologies that can be rendered in two-dimensional layouts, from systems for energy storage, to photovoltaics, optoelectronics, and others. © 2018 American Chemical Society. -
dc.language English -
dc.publisher American Chemical Society -
dc.title Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process -
dc.type Article -
dc.identifier.doi 10.1021/acsnano.8b00180 -
dc.identifier.wosid 000433404500011 -
dc.identifier.scopusid 2-s2.0-85047427878 -
dc.identifier.bibliographicCitation ACS Nano, v.12, no.5, pp.4164 - 4171 -
dc.description.isOpenAccess TRUE -
dc.subject.keywordAuthor three-dimensional electronics -
dc.subject.keywordAuthor mechanical buckling -
dc.subject.keywordAuthor silicon transistor -
dc.subject.keywordAuthor silicon diode -
dc.subject.keywordPlus SINGLE-CRYSTAL SILICON -
dc.subject.keywordPlus 3D -
dc.subject.keywordPlus DEVICES -
dc.citation.endPage 4171 -
dc.citation.number 5 -
dc.citation.startPage 4164 -
dc.citation.title ACS Nano -
dc.citation.volume 12 -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.relation.journalResearchArea Chemistry; Science & Technology - Other Topics; Materials Science -
dc.relation.journalWebOfScienceCategory Chemistry, Multidisciplinary; Chemistry, Physical; Nanoscience & Nanotechnology; Materials Science, Multidisciplinary -
dc.type.docType Article -

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