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Results 1541-1550 of 1957 (Search time: 0.006 seconds).

  • 2022-12-27
  • 함동호. 실시간 엣지 컴퓨팅 사용률을 반영한 동적 서비스 캐싱 시스템 및 방법.
  • View : 248
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  • 2023-04-27
  • 정희재. 온도 분석 방법 및 이에 사용되는 온도 센서.
  • View : 294
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  • Bisht, Prashant
  • Shim, Junoh
  • Oh, Jooon
  • Lee, Jieun
  • Shin, Hoseong
  • Jeong, Hyeonho
  • Kim, Jimin
  • Lee, Junho
  • Kwon, Hyuk-Jun
  • Kim, Sunkook
  • 2025-10
  • Bisht, Prashant. (2025-10). Next generation High-Mobility 2D chalcogenides TFT for display backplane. International Journal of Extreme Manufacturing, 7(5). doi: 10.1088/2631-7990/add4d1
  • IOP Publishing
  • View : 377
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  • Lee, Eunsang
  • Lee, Joon-Woo
  • Lee, Junghyun
  • Kim, Young-Sik
  • Kim, Yongjune
  • No, Jong-Seon
  • Choi, Woosuk
  • 2022-07-19
  • IEEE International Conference on Machine Learning (spotlight), pp.12403 - 12422
  • International Conference on Machine Learning (ICML)
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  • 2022-10-27
  • 24th International Congress on Acoustics, ICA 2022, pp.1 - 3
  • International Commission for Acoustics (ICA)
  • View : 409
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  • 2022-10-27
  • 24th International Congress on Acoustics, ICA 2022, pp.1 - 4
  • International Commission for Acoustics (ICA)
  • View : 308
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  • 임성훈
  • 김종민
  • 박지훈
  • 이경민
  • 이승훈
  • 2023-12-28
  • View : 1489
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  • 임준수
  • 박주형
  • 이성진
  • 구진형
  • 2022-06-16
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Hexagonal metal complex based mechanically robust transparent ultrathin gold μECoG for electro-optical neural interfaces

  • Kim, Duhee
  • Bissannagari, Murali
  • Kim, Boil
  • Hong, Nari
  • Park, Jaeu
  • Lim, Hyeongtae
  • Lee, Junhee
  • Lee, Jungha
  • Kim, Yoon Kyoung
  • Cho, Youngjae
  • et al
  • 2025-04
  • npj Flexible Electronics, v.9, no.1
  • Nature Publishing Group
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  • Lee, Jaewon
  • Jang, Seoyoung
  • Choi, Yujin
  • Kim, Donggeon
  • Braendli, Matthias
  • Morf, Thomas
  • Kossel, Marcel
  • Francese, Pier-Andrea
  • Kim, Gain
  • 2025-06
  • Lee, Jaewon. (2025-06). A 2-Lane DAC-/ADC-Based 2 × 2 MIMO PAM-4 MMSE-DFE Wireline Transceiver With FEXT Cancellation on RFSoC Platform. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 33(6), 1570–1581. doi: 10.1109/TVLSI.2025.3553400
  • Institute of Electrical and Electronics Engineers
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