Cited 15 time in webofscience Cited 15 time in scopus

Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices

Title
Thin Metallic Heat Sink for Interfacial Thermal Management in Biointegrated Optoelectronic Devices
Authors
Jung, Han HeeSong, JuwonNie, ShuangJung, Han NaKim, Min SeokJeong, Jae-WoongSong, Young MinSong, JizhouJang, Kyung-In
DGIST Authors
Jang, Kyung-In
Issue Date
2018-11
Citation
Advanced Materials Technologies, 3(11)
Type
Article
Article Type
Article
Keywords
flexible electronicsheat dissipationIII-V optoelectronicspulse oximetrythermal damageBloodDeteriorationFlexible electronicsHeat lossesHeat sinksHemodynamicsLight emitting diodesNoninvasive medical proceduresOptoelectronic devicesOximetersTemperature controlThermal conductivityTissueWearable technologyComputational analysisHeat dissipation capabilityHigh thermal conductivityIII-V optoelectronicsOptoelectronic modulesPulse oximetryThermal compatibilityThermal damageIntegrated optoelectronics
ISSN
2365-709X
Abstract
The applications of modern optoelectronic devices have been extended, and they now provide practical means for seamless real-time monitoring of blood flow dynamics, by being integrated with flexible and stretchable wearable sensor platform technology. However, thermal management of these devices remains limited by undesired thermal energy originating from the heating of the light-emitting diode. Specifically, the surface temperature of the optoelectronic device becomes very high compared to that of the adjacent biological tissue, causing challenges in skin–optoelectronics integration and functional deterioration of the light source. In this study, an optoelectronic module that integrates the light-emitting diode, photodetector, and a thin metallic heat sink element for sustainable in situ thermal management is developed. Experimental and computational analysis results indicate that the proposed optoelectronic device has excellent heat dissipation capabilities for thermally safe long-term usability, due to the high thermal conductivity of the device and film-type geometrical design of the embedded heat sink for skin application. The proposed optoelectronic device architecture with metallic heat sink offers an ideal option for blood flow monitoring by providing both mechanical and thermal compatibility with biological tissue suitable for long-term clinical applications. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
URI
http://hdl.handle.net/20.500.11750/9284
DOI
10.1002/admt.201800159
Publisher
Wiley-Blackwell
Related Researcher
  • Author Jang, Kyung-In Bio-integrated Electronics Lab
  • Research Interests Extreme mechanics; Stand-alone electronics; Heterogeneous materials; Biocompatible interfaces
Files:
There are no files associated with this item.
Collection:
Department of Robotics EngineeringBio-integrated Electronics Lab1. Journal Articles


qrcode mendeley

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE