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Showing results 1 to 4 of 4

Article
Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care
  • Chung, Ha Uk ; 
  • Kim, Bong Hoon ; 
  • Lee, Jong Yoon ; 
  • Lee, Jungyup ; 
  • Xie, Zhaoqian ; 
  • Ibler, Erin M. ; 
  • Lee, KunHyuck ; 
  • Banks, Anthony ; 
  • Jeong, Ji Yoon ; 
  • Kim, Jongwon ; 
    • et al
  • 2019-03
  • Chung, Ha Uk. (2019-03). Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care. doi: 10.1126/science.aau0780
  • American Association for the Advancement of Science
  • View : 732
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Article
Mechanically Guided Post-Assembly of 3D Electronic Systems
  • Kim, Bong Hoon ; 
  • Liu, Fei ; 
  • Yu, Yongjoon ; 
  • Jang, Hokyung ; 
  • Xie, Zhaoqian ; 
  • Li, Kan ; 
  • Lee, Jungyup ; 
  • Jeong, Ji Yoon ; 
  • Ryu, Arin ; 
  • Lee, Yechan ; 
    • et al
  • 2018-11
  • Kim, Bong Hoon. (2018-11). Mechanically Guided Post-Assembly of 3D Electronic Systems. Advanced Functional Materials, 28(48), 1–10. doi: 10.1002/adfm.201803149
  • Wiley-VCH Verlag
  • View : 913
  • Download : 0

Self-assembled three dimensional network designs for soft electronics

Article
Self-assembled three dimensional network designs for soft electronics
  • Jang, Kyung In ; 
  • Li, Kan ; 
  • Chung, Ha Uk ; 
  • Xu, Sheng ; 
  • Yang, Yiyuan ; 
  • Kwak, Jean Won ; 
  • Jung, Han Hee ; 
  • Song, Ju Won ; 
  • Yang, Ce ; 
  • Wang, Ao ; 
    • et al
  • 2017-06
  • Jang, Kyung In. (2017-06). Self-assembled three dimensional network designs for soft electronics. Nature Communications, 8. doi: 10.1038/ncomms15894
  • Nature Publishing Group
  • View : 1138
  • Download : 227
Article
Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process
  • Kim, Bong Hoon ; 
  • Lee, Jungyup ; 
  • Won, Sang Min ; 
  • Xie, Zhaoqian ; 
  • Chang, Jan-Kai ; 
  • Yu, Yongjoon ; 
  • Cho, Youn Kyoung ; 
  • Jang, Hokyung ; 
  • Jeong, Ji Yoon ; 
  • Lee, Yechan ; 
    • et al
  • 2018-05
  • Kim, Bong Hoon. (2018-05). Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process. ACS Nano, 12(5), 4164–4171. doi: 10.1021/acsnano.8b00180
  • American Chemical Society
  • View : 760
  • Download : 0
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