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Showing results 4 to 8 of 8

Issue Date Title Author(s) Journal View
2009
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2

Eom, Tae-Kwang ;  Sari, Windu ;  Choi, Kyu-Jeong ;  Shin, Woong-Chul ;  Kim, Jae Hyun ;  Lee, Do-Joong ;  Kim, Ki-Bum ;  Sohn, Hyunchul ;  Kim, Soo-Hyun

Electrochemical and Solid State Letters, v.12, no.11, pp.D85 - D88, 2009

 588
2009
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2

Eom, Tae-Kwang ;  Sari, Windu ;  Choi, Kyu-Jeong ;  Shin, Woong-Chul ;  Kim, Jae Hyun ;  Lee, Do-Joong ;  Kim, Ki-Bum ;  Sohn, Hyunchul ;  Kim, Soo-Hyun

Electrochemical and Solid State Letters, v.12, no.11, pp.D85 - D88, 2009

 49
2019-11
Low-Temperature Atomic Layer Deposition of Highly Conformal Tin Nitride Thin Films for Energy Storage Devices

Ansari, Mohd Zahid ;  Nandi, Dip K. ;  Janicek, Petr ;  Ansari, Sajid Ali ;  Ramesh, Rahul ;  Cheon, Taehoon ;  Shong, Bonggeun ;  Kim, Soo-Hyun

ACS Applied Materials & Interfaces, v.11, no.46, pp.43608 - 43621, 2019-11

 553
2023-04

Process Controlled Ruthenium on 2D Engineered V-MXene via Atomic Layer Deposition for Human Healthcare Monitoring

Process Controlled Ruthenium on 2D Engineered V-MXene via Atomic Layer Deposition for Human Healthcare Monitoring

Mohapatra, Debananda ;  Shin, Yujin ;  Ansari, Mohd Zahid ;  Kim, Youn-Hye ;  Park, Ye Jin ;  Cheon, Taehoon ;  Kim, Haekyoung ;  Lee, Jung Woo ;  Kim, Soo-Hyun

Advanced Science, v.10, no.12, 2023-04

 28
2021-02
Ultralow Loading (Single-Atom and Clusters) of the Pt Catalyst by Atomic Layer Deposition Using Dimethyl ((3,4-eta) N,N-dimethyl-3-butene-1-amine-N) Platinum (DDAP) on the High-Surface-Area Substrate for Hydrogen Evolution Reaction

Ramesh, Rahul ;  Han, Seungmin ;  Nandi, Dip K. ;  Sawant, Sandesh Y. ;  Kim, Deok Hyun ;  Cheon, Taehoon ;  Cho, Moo Hwan ;  Harada, Ryosuke ;  Shigetomi, Toshiyuki ;  Suzuki, Kazuharu ;  et al

Advanced Materials Interfaces, v.8, no.3, pp.2001508, 2021-02

 359
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