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Issue Date	Title Author(s) Journal	View
2019-10	Crystal alignment of a LiFePO4 cathode material for lithium ion batteries using its magnetic properties Kim, Cham ; Yang, Yeokyung ; Ha, D. ; Kim, Dong Hwan ; Kim, Hoyoung Royal Society of Chemistry, 2019-10	630
2020-06	Thermoelectric properties of PEDOT: PSS and acid-treated SWCNT composite films Chung, Seok-Hwan ; Kim, Dong Hwan ; Kim, Hanna ; Kim, Hoyoung ; Jeong, Sang Won Elsevier BV, 2020-06	670
2017-09-12	Evaluation of interfacial resistances for thermoelectric devices Kim, Dong Hwan ; Kim, Cham ; Kim, Jong Tae ; Yoon, Duck Ki ; Kim, Hoyoung Annual Meeting of the Thermoelectrics Society of Japan 2017, pp.140, 2017-09-12	27
2017-09-12	Synthesis and thermoelectric properties of Bi and Sb co-doped Mg-Si thermoelectic materials Kim, Dong Hwan ; Lee, Jihyeon ; Ahn, Jihyeon ; Park, Kwanho ; Kim, Cham ; Kim, Hoyoung Annual Meeting of the Thermoelectrics Society of Japan 2017, 2017-09-12	26
2012-06	Significant Enhancement in the Thermoelectric Performance of a Bismuth Telluride Nanocompound through Brief Fabrication Procedures Kim, Cham ; Kim, Dong Hwan ; Kim, Hoyoung ; Chung, Jong Shik ACS Applied Materials & Interfaces, v.4, no.6, pp.2949 - 2954, 2012-06	27
2011-07	Fabrication and thermoelectric properties of c-axis-aligned Bi0.5Sb1.5Te3 with a high magnetic field Kim, Dong Hwan ; Kim, Cham ; Je, Koo-Chul ; Ha, Gook Hyun ; Kim, Hoyoung Acta Materialia, v.59, no.12, pp.4957 - 4963, 2011-07	29
2011-01	Influence of powder morphology on thermoelectric anisotropy of spark-plasma-sintered Bi-Te-based thermoelectric materials Kim, Dong Hwan ; Kim, Cham ; Heo, Seong Hyeon ; Kim, Hoyoung Acta Materialia, v.59, no.1, pp.405 - 411, 2011-01	29
2022-03	High-temperature Bi2Te3 thermoelectric generator fabricated using Cu nanoparticle paste bonding Chung, Seok-Hwan ; Kim, Jong Tae ; Kim, Hoyoung ; Kim, Jeongmin ; Kim, Dong Hwan Journal of Alloys and Compounds, v.896, 2022-03	443
2022-03	Magnetic alignment of graphite platelets in polyimide matrix toward a flexible electronic substrate with enhanced thermal conductivity Chung, Seok-Hwan ; Kim, Jong Tae ; Kim, Hoyoung ; Kim, Dong Hwan ; Jeong, Sang Won Materials Today Communications, v.30, 2022-03	392

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