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Integrated Piezoelectric AlN Thin Film with SU-8/PDMS Supporting Layer for Flexible Sensor Array
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- Title
- Integrated Piezoelectric AlN Thin Film with SU-8/PDMS Supporting Layer for Flexible Sensor Array
- DGIST Authors
- Yeo, Hong Goo ; Jung, Joontaek ; Sim, Minkyung ; Jang, Jae Eun ; Choi, Hongsoo
- Issued Date
- 2020-01
- Citation
- Yeo, Hong Goo. (2020-01). Integrated Piezoelectric AlN Thin Film with SU-8/PDMS Supporting Layer for Flexible Sensor Array. doi: 10.3390/s20010315
- Type
- Article
- Article Type
- Article
- Author Keywords
- piezoelectric tactile sensor ; aluminum nitride ; thin film ; flexible support layer
- Keywords
- POLYMER TACTILE SENSOR ; ELECTRONIC SKIN ; IN-VIVO ; PVDF ; PZT ; POLYDIMETHYLSILOXANE ; FABRICATION ; SU-8
- ISSN
- 1424-8220
- Abstract
-
This research focuses on the development of a flexible tactile sensor array consisting of aluminum nitride (AlN) based on micro-electro-mechanical system (MEMS) technology. A total of 2304 tactile sensors were integrated into a small area of 2.5 × 2.5 cm2. Five hundred nm thick AlN film with strong c-axis texture was sputtered on Cr/Au/Cr (50/50/5 nm) layers as the sacrificial layer coated on a Si wafer. To achieve device flexibility, polydimethylsiloxane (PDMS) polymer and SU-8 photoresist layer were used as the supporting layers after etching away a release layer. Twenty-five mM (3-mercaptopropyl) trimethoxysilane (MPTMS) improves the adhesion between metal and polymers due to formation of a self-assembled monolayer (SAM) on the surface of the top electrode. The flexible tactile sensor has 8 × 8 channels and each channel has 36 sensor elements with nine SU-8 bump blocks. The tactile sensor array was demonstrated to be flexible by bending 90 degrees. The tactile sensor array was demonstrated to show clear spatial resolution through detecting the distinct electrical response of each channel under local mechanical stimulus. © 2020 by the authors. Licensee MDPI, Basel, Switzerland.
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- Publisher
- MDPI AG
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Related Researcher
- Jang, Jae Eun장재은
-
Department of Electrical Engineering and Computer Science
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