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고통 감지 장치 및 방법
- Department of Robotics and Mechatronics Engineering
- Bio-Micro Robotics Lab
- 3. Patents
- Department of Electrical Engineering and Computer Science
- CSP(Communication and Signal Processing) Lab
- 3. Patents
- Department of Brain Sciences
- Laboratory of Chemical Senses
- 3. Patents
- Department of Electrical Engineering and Computer Science
- Advanced Electronic Devices Research Group(AEDRG) - Jang Lab.
- 3. Patents
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- Title
- 고통 감지 장치 및 방법
- Alternative Title
- METHOD AND DEVICE FOR SENSING PAIN
- Country
- US
- Application Date
- 2016-08-12
- Application No.
- 15-235395
- Registration Date
- 2018-06-19
- Publication No.
- 10-001-422
- Assignee
- (재)대구경북과학기술원(100/100)
- Abstract
-
A pain sensing device includes a sensor array including a plurality of sensors that sense pressure generated due to a contact of an object and output electrical piezoelectric signals; and a signal processor configured to recognize the shape of the object based on the number of sensors that output the piezoelectric signals among the plurality of sensors, and to generate a pain signal according to the recognized shape of the object.
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Related Researcher
- Choi, Ji-Woong최지웅
-
Department of Electrical Engineering and Computer Science
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