Department of Electrical Engineering and Computer Science
CSP(Communication and Signal Processing) Lab
3. Patents
고통 감지 장치 및 방법
- Title
- 고통 감지 장치 및 방법
- Alternative Title
- METHOD AND DEVICE FOR SENSING PAIN
- Country
- US
- Application Date
- 2016-08-12
- Application No.
- 15-235395
- Registration Date
- 2018-06-19
- Publication No.
- 10-001-422
- Assignee
- (재)대구경북과학기술원(100/100)
- Abstract
- A pain sensing device includes a sensor array including a plurality of sensors that sense pressure generated due to a contact of an object and output electrical piezoelectric signals; and a signal processor configured to recognize the shape of the object based on the number of sensors that output the piezoelectric signals among the plurality of sensors, and to generate a pain signal according to the recognized shape of the object.
- Related Researcher
-
-
Choi, Ji-Woong
- Research Interests Communication System; Signal Processing; Communication Circuit Design; 생체 신호 통신 및 신호 처리; 뇌-기계 인터페이스(BMI); 차세대 교차계층 통신 및 신호 처리; 5G 모바일 통신
-
- Files in This Item:
-
There are no files associated with this item.
- Appears in Collections:
- Department of Robotics and Mechatronics Engineering Bio-Micro Robotics Lab 3. Patents
- Department of Electrical Engineering and Computer Science CSP(Communication and Signal Processing) Lab 3. Patents
- Department of Brain Sciences Laboratory of Chemical Senses 3. Patents
- Department of Electrical Engineering and Computer Science Advanced Electronic Devices Research Group(AEDRG) - Jang Lab. 3. Patents
Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.