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Issue Date Title Author(s) Journal View
2020-09

Conformal and Ultra Shallow Junction Formation Achieved Using a Pulsed-Laser Annealing Process Integrated With a Modified Plasma Assisted Doping Method

Baik, Seunghun Kwon, Dong-Jae Kang, Hongki Jang, Jae Eun Jang, Jaewon Kim, Y. S. Kwon, Hyuk-Jun

Institute of Electrical and Electronics Engineers Inc., 2020-09

452
2019-09

Baik, Seunghun Kwon, Hyeokjin Paeng, Chuck Zhang, He Kalkofen, Bodo Jang, Jae Eun Kim, Y. S. Kwon, Hyuk-Jun

IEEE Electron Device Letters, v.40, no.9, pp.1507 - 1510, 2019-09

505
2022-08

Jeong, Heejae Kim, Y. S. Baik, Seunghun Kang, Hongki Jang, Jae Eun Kwon, Hyuk-Jun

IEEE Electron Device Letters, v.43, no.8, pp.1315 - 1318, 2022-08

148
2023-01

Baek, Jongyeon Kim, Seung-Hwan Jeong, Heejae Nguyen, Manh-Cuong Baek, Daeyoon Baik, Seunghun Nguyen, An Hoang-Thuy Baek, Jong-Hwa Kim, Hyung-jun Kwon, Hyuk-Jun et al

Applied Surface Science, v.609, 2023-01

107
2019-02

Ultra-Short Pulsed Laser Annealing Effects on MoS2 Transistors with Asymmetric and Symmetric Contacts

Kwon, Hyeokjin Baik, Seunghun Jang, Jae Eun Jang, Jaewon Kim, Sunkook Grigoropoulos, Costas P. Kwon, Hyuk Jun

MDPI AG, 2019-02

550
2023-11

Baik, Seunghun Jeong, Heejae Park, Geuntae Kang, Hongki Jang, Jae Eun Kwon, Hyuk-Jun

Applied Surface Science, v.638, 2023-11

35
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