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Interfacial and surface analysis of parylene C-modified PDMS substrates for soft bioelectronics

Interfacial and surface analysis of parylene C-modified PDMS substrates for soft bioelectronics
Chou, NamsunMoon, HyunminPark, JinheeKim, Sohee
DGIST Authors
Chou, NamsunMoon, HyunminPark, JinheeKim, Sohee
Issued Date
Author Keywords
Mixed interfacial analysisParylene CParylene C-deposited PDMSParylene C-filled PDMSPDMSSoft bioelectronics
MicrochannelsMicrocracksPulse width modulationSecondary ion mass spectrometrySiliconesEtching timeMicro-fabricationMixed interfacial analyseParylene CParylene C-deposited polydimethylsiloxaneParylene C-filled polydimethylsiloxaneSoft bioelectronicSoft electronicsStable metalsPolydimethylsiloxaneSubstratesSurface analysisElectronics devices
Parylene C-modified polydimethylsiloxane (PDMS) substrates such as parylene C-deposited PDMS and parylene C-filled PDMS have been developed for the microfabrication of soft electronic devices with mechanically and electrically stable metal patterns. In previous studies, we performed oxygen plasma etching to etch parylene C away from the PDMS surface of parylene C-deposited PDMS to maximize the benefits of soft and stretchable properties of PDMS. However, the resultant parylene C-filled PDMS exhibited microcracks during thin film metal patterning as the etching time increased. In this study, to analyze this cracking phenomenon precisely, the penetration depth of parylene C into PDMS was quantitatively investigated according to the thickness of deposited parylene C, and the amount of parylene C on the surface as well as in the interfacial region formed by parylene C and PDMS was analyzed depending on the etching time. It was observed that residual parylene C remained in the PDMS pores even after parylene C was etched away from the PDMS surface. In addition, we confirmed that only the amount of parylene C on the PDMS surface was reduced by excessive etching, and parylene C inside the PDMS pores was not significantly affected. From these results, we could confirm that the optimal condition to fabricate the parylene C-filled PDMS substrate was to etch parylene C just from the surface of PDMS without over-etching. The parylene C-filled PDMS substrate would enable the wafer-scale high-yield fabrication of soft bioelectronics for diverse applications. © 2021 Elsevier B.V.
Elsevier BV
Related Researcher
  • 박진희 Park, Jinhee 화학물리학과
  • Research Interests Organic-Inorganic Hybrid Materials; Metal-Organic Polyheda;Metal-Organic Frameworks; Porous Polymer Networks
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Department of Robotics and Mechatronics Engineering Neural Interfaces & MicroSystems Lab 1. Journal Articles
Department of Physics and Chemistry Organic-Inorganic Hybrids Lab 1. Journal Articles


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