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Department of Electrical Engineering and Computer Science
CSI(Cyber-Physical Systems Integration) Lab
1. Journal Articles
PINMAP: A Cost-efficient Algorithm for Glass Detection and Mapping Using Low-cost 2D LiDAR
Chae, Jiyeong
;
Seo, Hyunkyo
;
Lee, Sanghoon
;
Park, Yujin
;
Park, Hyung-Seok
;
Park, Kyung-Joon
Department of Electrical Engineering and Computer Science
CSI(Cyber-Physical Systems Integration) Lab
1. Journal Articles
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Title
PINMAP: A Cost-efficient Algorithm for Glass Detection and Mapping Using Low-cost 2D LiDAR
Issued Date
2025-05
Citation
IEEE Transactions on Instrumentation and Measurement, v.74
Type
Article
Author Keywords
Autonomous mobile robots (AMRs)
;
glass detection
;
navigation
;
probabilistic mapping
;
simultaneous localization and mapping (SLAM)
ISSN
0018-9456
Abstract
Autonomous Mobile Robots (AMRs) have seen rapid adoption due to their ability to autonomously navigate, avoid obstacles, and collaborate efficiently in complex environments. AMRs equipped with LiDAR-based Simultaneous Localization and Mapping (SLAM) are effective in obstacle-rich settings. However, SLAM approaches, particularly those using low-cost 2D LiDAR, face challenges in accurately detecting and mapping glass surfaces. AMRs may interpret glass as open space, potentially leading to collisions. In this paper, we propose a novel framework, Probabilistic Incremental Navigation-based Mapping with Accumulative Point cloud data (PINMAP), which enables glass detection and mapping without additional sensor hardware or high-cost LiDAR systems. The proposed PINMAP framework offers three key advantages: First, PINMAP achieves accurate detection and mapping of transparent obstacles, such as glass, using only low-cost 2D LiDAR. Second, PINMAP distinguishes between static and temporary obstacles, effectively adapting to dynamic environments. Finally, PINMAP significantly reduces mapping costs by eliminating the need for manual labeling of glass and temporary obstacles. We empirically validate the performance of PINMAP through extensive experiments, including highly dynamic real-world scenarios. © IEEE.
URI
https://scholar.dgist.ac.kr/handle/20.500.11750/58398
DOI
10.1109/TIM.2025.3566826
Publisher
Institute of Electrical and Electronics Engineers Inc.
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