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Implementation of an FPGA-Based 3D Shape Measurement System Using High-Level Synthesis
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Title
Implementation of an FPGA-Based 3D Shape Measurement System Using High-Level Synthesis
Issued Date
2024-08
Citation
Kim, Tae-Hyeon. (2024-08). Implementation of an FPGA-Based 3D Shape Measurement System Using High-Level Synthesis. Electronics, 13(16), 1–14. doi: 10.3390/electronics13163282
Type
Article
Author Keywords
3D shape measurementphase measuring profilometry (PMP)FPGAhigh-level synthesis (HLS)real-time processing
Keywords
REAL-TIMEPHASEPROFILOMETRY
ISSN
2079-9292
Abstract
Three-dimensional(3D) shape measurement using point clouds has recently gained significant attention. Phase measuring profilometry (PMP) is widely preferred for its robustness against external lighting changes and high-precision results. However, PMP suffers from long computation times due to complex calculations and its high memory usage. It also faces a 2π ambiguity issue, as the measured phase is limited to the 2π range. This is typically resolved using dual-wavelength methods. However, these methods require separate measurements of phase changes at two wavelengths, increasing the data processing volume and computation times. Our study addresses these challenges by implementing a 3D shape measurement system on a System-on-Chip (SoC)-type Field-Programmable Gate Array (FPGA). We developed a PMP algorithm with dual-wavelength methods, accelerating it through high-level synthesis (HLS) on the FPGA. This hardware implementation significantly reduces computation time while maintaining measurement accuracy. The experimental results demonstrate that our system operates correctly on the SoC-type FPGA, achieving computation speeds approximately 11.55 times higher than those of conventional software implementations. Our approach offers a practical solution for real-time 3D shape measurement, potentially benefiting applications in fields such as quality control, robotics, and computer vision. © 2024 by the authors.
URI
http://hdl.handle.net/20.500.11750/57253
DOI
10.3390/electronics13163282
Publisher
MDPI
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