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Issue Date	Title Author(s) Journal	View
2018-05	Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process Kim, Bong Hoon ; Lee, Jungyup ; Won, Sang Min ; Xie, Zhaoqian ; Chang, Jan-Kai ; Yu, Yongjoon ; Cho, Youn Kyoung ; Jang, Hokyung ; Jeong, Ji Yoon ; Lee, Yechan ; Ryu,Arin ; Kim, Do Hoon ; Lee, Kun Hyuck ; Lee, Jong Yoon ; Liu, Fei ; Wang, Xueju ; Huo, Qingze ; Min, Seunghwan ; Wu, Di ; Ji, Bowen ; Banks, Anthony ; Kim, Jeonghyun ; Oh, Nuri ; Jin, Hyeong Min ; Han, Seungyong ; Kang, Daeshik ; Lee, Chi Hwan ; Song, Young Min ; Zhang, Yihui ; Huang, Yonggang ; Jang, Kyung-In ; Rogers, John A. ACS Nano, v.12, no.5, pp.4164 - 4171, 2018-05	616
2021-07	Instant, multiscale dry transfer printing by atomic diffusion control at heterogeneous interfaces Heo, Seungkyoung ; Ha, Jeongdae ; Son, Sook Jin ; Choi, In Sun ; Lee, Hyeokjun ; Oh, Saehyun ; Jekal, Janghwan ; Kang, Min Hyung ; Lee, Gil Ju ; Jung, Han Hee ; Yea, Junwoo ; Lee, Taeyoon ; Lee, Youngjeon ; Choi, Ji-Woong ; Xu, Sheng ; Choi, Joon Ho ; Jeong, Jae-Woong ; Song, Young Min ; Rah, Jong-Cheol ; Keum, Hohyun ; Jang, Kyung-In Science Advances, v.7, no.28, 2021-07	453

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